SLLSF22H April   2018  – June 2024 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description Continued
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: Driver
    10. 7.10 Electrical Characteristics: Receiver
    11. 7.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 7.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 7.13 Switching Characteristics: Driver
    14. 7.14 Switching Characteristics: Receiver
    15. 7.15 Insulation Characteristics Curves
    16. 7.16 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Failsafe Receiver
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 Glitch-Free Power Up and Power Down
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Data Rate and Bus Length
        2. 10.2.2.2 Stub Length
        3. 10.2.2.3 Bus Loading
      3. 10.2.3 Application Curves
        1. 10.2.3.1 Insulation Lifetime
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
        1. 13.1.1.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  15. 14Revision History
  16. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The ISO14xx devices are galvanically-isolated differential line transceivers for TIA/EIA RS-485 and RS-422 applications. These noise-immune transceivers are designed to operate in harsh industrial environments. The bus pins of these devices can endure high levels of IEC electrostatic discharge (ESD) and IEC electrical fast transient (EFT) events which eliminates the need for additional components on bus for system-level protection. The devices are available for both basic and reinforced isolation (see Reinforced and Basic Isolation Options).

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
ISO1410, ISO1410B SOIC (16) 10.30mm × 10.30mm
ISO1412, ISO1412B
ISO1430, ISO1430B
ISO1432, ISO1432B
ISO1450, ISO1450B
ISO1452, ISO1452B
(1) For more information, see Section 15.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
Reinforced and Basic Isolation Options
Feature ISO14xx ISO14xxB
Protection level Reinforced Basic
Surge test voltage per VDE 10000VPK 6000VPK
Isolation rating per UL 5000VRMS 5000VRMS
Working voltage per VDE 1060VRMS /
1500VPK		 1060VRMS /
1500VPK
ISO1450 ISO1452 ISO1410 ISO1412 ISO1430 ISO1432 Simplified Application Schematic Simplified Application Schematic