SLLSF22H April   2018  – June 2024 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description Continued
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: Driver
    10. 7.10 Electrical Characteristics: Receiver
    11. 7.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 7.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 7.13 Switching Characteristics: Driver
    14. 7.14 Switching Characteristics: Receiver
    15. 7.15 Insulation Characteristics Curves
    16. 7.16 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Failsafe Receiver
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 Glitch-Free Power Up and Power Down
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Data Rate and Bus Length
        2. 10.2.2.2 Stub Length
        3. 10.2.2.3 Bus Loading
      3. 10.2.3 Application Curves
        1. 10.2.3.1 Insulation Lifetime
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
        1. 13.1.1.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  15. 14Revision History
  16. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.12 Supply Current Characteristics: Side 2 (ICC2)

 VRE = VGND1 or VRE = VCC1 (over recommended operating conditions unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DRIVER ENABLED, BUS UNLOADED
Bus-side supply currentVD = VCC1, VCC2 = 3.3 V ± 10%46.1mA
Bus-side supply currentVD = VCC1, VCC2 = 5 V ± 10%4.56.6mA
DRIVER ENABLED, BUS LOADED
Bus-side supply currentVD = VCC1, RL = 54 Ω, VCC2 = 3.3 V ± 10%4858mA
Bus-side supply currentVD = VCC1, RL = 54 Ω, VCC2 = 5 V ± 10%7488mA
Bus-side supply currentISO141x, D = 500-kbps square wave with 50% duty cycle, RL = 54 Ω, CL = 50 pF, VCC2 = 3.3 V ± 10%6395mA
Bus-side supply currentISO141x, D = 500-kbps square wave with 50% duty cycle, RL = 54 Ω, CL = 50 pF, VCC2 = 5 V ± 10%113160mA
Bus-side supply currentISO143x, D = 12-Mbps square wave with 50% duty cycle, RL = 54 Ω, CL = 50 pF, VCC2 = 3.3 V ± 10%5675mA
Bus-side supply currentISO143x, D = 12-Mbps square wave with 50% duty cycle, RL = 54 Ω, CL = 50 pF, VCC2 = 5 V ± 10%97122mA
Bus-side supply currentISO145x, D = 50-Mbps square wave with 50% duty cycle, RL = 54 Ω, CL = 50 pF, VCC2 = 3.3 V ± 10%84103mA
Bus-side supply currentISO145x, D = 50-Mbps square wave with 50% duty cycle, RL = 54 Ω, CL = 50 pF, VCC2 = 5 V ± 10%134162mA
DRIVER DISABLED, BUS LOADED OR UNLOADED
Bus-side supply currentVD = VCC1, VCC2 = 3.3 V ± 10%2.64.3mA
Bus-side supply currentVD = VCC1, VCC2 = 5 V ± 10%2.84.5mA