SLLSEX0D November   2016  – December 2022 ISO1540-Q1 , ISO1541-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Supply Current Characteristics
    11. 6.11 Timing Requirements
    12. 6.12 Switching Characteristics
    13. 6.13 Insulation Characteristics Curves
    14. 6.14 Typical Characteristics
      1.      Parameter Measurement Information
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Isolator Functional Principle
      1. 7.4.1 Receive Direction (Left Diagram of )
      2. 7.4.2 Transmit Direction (Right Diagram of )
    5. 7.5 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 I2C Bus Overview
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics

over recommended operating conditions, unless otherwise noted
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
3 V ≤ VCC1, VCC2 ≤ 3.6 V
tf1Output Signal Fall Time (SDA1, SCL1)See Figure 7-1
R1 = 953 Ω,
C1 = 40 pF
0.7 × VCC1 to 0.3 × VCC181729ns
0.9 × VCC1 to 900 mV162948
tf2Output Signal Fall Time (SDA2, SCL2)See Figure 7-1
R2 = 95.3 Ω,
C2 = 400 pF
0.7 × VCC2 to 0.3 × VCC2142347ns
0.9 × VCC2 to 400 mV3550100
tpLH1-2Low-to-High Propagation Delay, Side 1 to Side 2See Figure 7-1
R1 = 953 Ω,
R2 = 95.3 Ω,
C1, C2 = 10 pF
0.55 V to 0.7 × VCC23365ns
tPHL1-2High-to-Low Propagation Delay, Side 1 to Side 20.7 V to 0.4 V90181ns
PWD1-2Pulse Width Distortion
|tpHL1-2 – tpLH1-2|
55123ns
tPLH2-1(1)Low-to-High Propagation Delay, Side 2 to Side 10.4 × VCC2 to 0.7 × VCC14768ns
tPHL2-1(1)High-to-Low Propagation Delay, Side 2 to Side 10.4 × VCC2 to 0.9 V67109ns
PWD2-1(1)Pulse Width Distortion
|tpHL2-1 – tpLH2-1|
2049ns
tLOOP1(1)Round-trip propagation delay on Side 1See Figure 7-2;
R1 = 953 Ω, C1 = 40 pF
R2 = 95.3 Ω, C2 = 400 pF
0.4 V to 0.3 × VCC1100165ns
4.5 V ≤ VCC1, VCC2 ≤ 5.5 V
tf1Output Signal Fall Time (SDA1, SCL1)See Figure 7-1
R1 = 1430 Ω,
C1 = 40 pF
0.7 × VCC1 to 0.3 × VCC161122ns
0.9 × VCC1 to 900 mV132148
tf2Output Signal Fall Time (SDA2, SCL2)See Figure 7-1
R2 = 143 Ω,
C2 = 400 pF
0.7 × VCC2 to 0.3 × VCC2101835ns
0.9 × VCC2 to 400 mV284176
tpLH1-2Low-to-High Propagation Delay, Side 1 to Side 2See Figure 7-1
R1 = 1430 Ω,
R2 = 143 Ω,
C1,2 = 10 pF
0.55 V to 0.7 × VCC23162ns
tPHL1-2High-to-Low Propagation Delay, Side 1 to Side 20.7 V to 0.4 V70139ns
PWD1-2Pulse Width Distortion
|tpHL1-2 – tpLH1-2|
3880ns
tPLH2-1(1)Low-to-high propagation delay, side 2 to side 10.4 × VCC2 to 0.7 × VCC15580ns
tPHL2-1(1)High-to-low propagation delay, Side 2 to side 10.4 × VCC2 to 0.9 V4785ns
PWD2-1(1)Pulse Width Distortion
|tpHL2-1 – tpLH2-1|
834ns
tLOOP1(1)Round-trip propagation delay on side 1See Figure 7-2;
R1 = 1430 Ω, C1 = 40 pF
R2 = 143 Ω, C2 = 400 pF
0.4 V to 0.3 × VCC1110180ns
This parameter does not apply to the ISO1541-Q1 SCL1 line as it is unidirectional.