SLLSFC2D December   2020  – September 2021 ISO1640 , ISO1641 , ISO1642 , ISO1643 , ISO1644

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Supply Current Characteristics
    11. 6.11 Timing Requirements
    12. 6.12 I2C Switching Characteristics
    13. 6.13 GPIO Switching Characteristics
    14. 6.14 Insulation Characteristics Curves
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Isolation Technology Overview
    4. 8.4 Feature Description
      1. 8.4.1 Hot Swap
      2. 8.4.2 Protection Features
      3. 8.4.3 GPIO Channels
    5. 8.5 Isolator Functional Principle
      1. 8.5.1 Receive Direction (Left Diagram of Figure 1-1 )
      2. 8.5.2 Transmit Direction (Right Diagram of Figure 1-1 )
    6. 8.6 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 I2C Bus Overview
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Safety Limiting Values

Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO1640/1 D-8 PACKAGE
IS Safety input, output, or supply current(1) RθJA = 106.3 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C 214 mA
RθJA = 106.3 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C 327
PS Safety input, output, or total power(1) RθJA = 106.3 °C/W, TJ = 150°C, TA = 25°C 1176 mW
TS Safety temperature(1) 150 °C
ISO1640/1 DW-16 PACKAGE
IS Safety input, output, or supply current(1) RθJA = 62.4 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C 365 mA
RθJA = 62.4 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C 557
PS Safety input, output, or total power(1) RθJA = 62.4 °C/W, TJ = 150°C, TA = 25°C,  2004 mW
TS Safety temperature(1) 150 °C
ISO1642/3/4 DW-16 Package
IS Safety input, output, or supply current(1) RθJA = 58.3 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C 390 mA
RθJA = 58.3 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C 596 mA
PS Safety input, output, or total power(1) RθJA = 58.3 °C/W, TJ = 150°C, TA = 25°C 2145 mW
TS Safety temperature(1) 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.