SLLSEN5C june   2015  – may 2023 ISO5851

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Function
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Characteristics
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and Active Miller Clamp
      2. 9.3.2 Active Output Pulldown
      3. 9.3.3 Undervoltage Lockout (UVLO) With Ready (RDY) Pin Indication Output
      4. 9.3.4 Fault ( FLT) and Reset ( RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5851 Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (January 2017) to Revision C (May 2023)

  • Added Additional manufacturing certification pending in the Safety-Related Certifications tableGo

Changes from Revision A (June 2015) to Revision B (January 2017)

  • Changed the Title From: "Active Safety Features" To: Active Protection Features" Go
  • Changed Feature From: Surge Immunity 12800-VPK (according to IEC 61000-4-5) To: Isolation Surge Withstand Voltage 12800-VPK Go
  • Added Feature to Safety and Regulatory Certifications: TUV Certification per EN 61010-1 and EN 60950-1Go
  • Added the Power Ratings table Go
  • Moved Insulation Characteristics to the Specifications Go
  • Changed the Test Conditions and values for qpd in Insulation Characteristics Go
  • Changed RIO From: 100°C ≤ TA ≤ max To: 100°C ≤ TA ≤ 125°C in the Insulation Characteristics Go
  • Moved Safety-Related Certifications to the Specifications Go
  • Changed the CSA status from planned to certifiedGo
  • Moved Safety Limiting Values to the Specifications Go
  • Added the Reinforced High-Voltage Capacitor Life Time Projection figure to Insulation Characteristics Curves Go
  • Changed the Thermal Derating Curve for Limiting Current per VDE figure and Added the Thermal Derating Curve for Limiting Power per VDE figureGo
  • Added the ICC1 Supply Current vs Temperature figure to the Typical Characteristics Go
  • Changed the OUT Propagation Delay, Non-Inverting Configuration figure Go
  • Changed the OUT Propagation Delay, Inverting Configuration figureGo
  • Added text ", but connecting CLAMP output of the gate driver to the IGBT gate is also not an issue." to Supply and Active Miller Clamp Go
  • Changed the second paragraph of the Section 10.2 Go
  • Added text "and RST input signal" to Section 10.2.1 Go
  • Deleted text " and a 220-pF filtering capacitor." from Recommended ISO5851 Application Circuit Go
  • Deleted text "thereby, providing protection against further catastrophic failures." From: the Global-Shutdown and Reset sectionGo
  • Changed the Normal Operation - Bipolar Supply and Normal Operation - Unipolar Supply figuresGo
  • Changed the PCB Material sectionGo

Changes from Revision * (June 2015) to Revision A (June 2015)

  • Changed from a 1-page Product Preview to the full datasheet. Go