SLLSEN5C june   2015  – may 2023 ISO5851

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Function
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Characteristics
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and Active Miller Clamp
      2. 9.3.2 Active Output Pulldown
      3. 9.3.3 Undervoltage Lockout (UVLO) With Ready (RDY) Pin Indication Output
      4. 9.3.4 Fault ( FLT) and Reset ( RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5851 Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.12 Typical Characteristics

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VCC2 = 30 V
Figure 7-4 Output High Drive Current vs Temperature
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Figure 7-6 Output High Drive Current vs Output Voltage
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Unipolar: VCC2 – VEE2 = VCC2 – GND2
Figure 7-8 DESAT Threshold Voltage vs Temperature
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VCC2 = 30 V
Figure 7-5 Output Low Drive Current vs Temperature
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Figure 7-7 Output Low Drive Current vs Output Voltage
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CL = 1 nFRG = 0 Ω
VCC2 – VEE2 = VCC2 – GND2 = 20 V
Figure 7-9 OUT Transient Waveform
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CL = 10 nFRG = 0 Ω
VCC2 – VEE2 = VCC2 – GND2 = 20 V
Figure 7-11 OUT Transient Waveform
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CL = 100 nFRG = 0 Ω
VCC2 – VEE2 = VCC2 – GND2 = 20 V
Figure 7-13 OUT Transient Waveform
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CL = 100 nFRG = 10 Ω
VCC2 – VEE2 = VCC2 – GND2 = 20 V
Figure 7-15 OUT Transient Waveform DESAT and FLT
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IN+ = LowIN– = Low
Figure 7-17 ICC1 Supply Current vs Temperature
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Figure 7-19 ICC1 Supply Current vs Input Frequency
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RG = 10 Ω, 20 kHz
Figure 7-21 ICC2 Supply Current vs Load Capacitance
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CL = 1 nFRG = 0 ΩVCC2 = 15 V
Figure 7-23 VCC2 Propagation Delay vs Temperature
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RG = 0 ΩVCC1 = 5 V
Figure 7-25 tr Rise Time vs Load Capacitance
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RG = 10 ΩVCC1 = 5 V
Figure 7-27 tr Rise Time vs Load Capacitance
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Figure 7-29 Leading Edge Blanking Time With Temperature
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CL = 1 nF
Figure 7-31 DESAT Sense to FLT Low Delay vs Temperature
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Figure 7-33 Miller Clamp Current vs Temperature
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Figure 7-35 VCLP_CLAMP - Short Circuit Clamp Voltage on Clamp Across Temperature
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VCC2 = 15 VDESAT = 6 V
Figure 7-37 Blanking Capacitor Charging Current vs Temperature
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CL = 1 nFRG = 10 Ω
VCC2 – VEE2 = VCC2 – GND2 = 20 V
Figure 7-10 OUT Transient Waveform
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CL = 10 nFRG = 10 Ω
VCC2 – VEE2 = VCC2 – GND2 = 20 V
Figure 7-12 OUT Transient Waveform
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CL = 100 nFRG = 10 Ω
VCC2 – VEE2 = VCC2 – GND2 = 20 V
Figure 7-14 OUT Transient Waveform
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IN+ = HighIN– = Low
Figure 7-16 ICC1 Supply Current vs Temperature
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Input Frequency = 1 kHz
Figure 7-18 ICC2 Supply Current vs Temperature
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no CL
Figure 7-20 ICC2 Supply Current vs Input Frequency
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CL = 1nFRG = 0 ΩVCC1 = 5 V
Figure 7-22 VCC1 Propagation Delay vs Temperature
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RG = 10 ΩVCC1 = 5 V
Figure 7-24 Propagation Delay vs Load Capacitance
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RG = 0 ΩVCC1 = 5 V
Figure 7-26 tf Fall Time v. Load Capacitance
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RG = 10 ΩVCC1 = 5 V
Figure 7-28 tf Fall Time vs Load Capacitance
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CL = 10 nF
Figure 7-30 DESAT Sense to VOUT 10% Delay vs Temperature
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Figure 7-32 Reset to Fault Delay Across Temperature
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Figure 7-34 Active Pulldown Voltage vs Temperature
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Figure 7-36 VOUT_CLAMP - Short Circuit Clamp Voltage on OUT Across Temperature