SLLSFK2C august   2021  – may 2023 ISO6760-Q1 , ISO6761-Q1 , ISO6762-Q1 , ISO6763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Electrical Characteristics—1.8-V Supply
    16. 6.16 Supply Current Characteristics—1.8-V Supply
    17. 6.17 Switching Characteristics—5-V Supply
    18. 6.18 Switching Characteristics—3.3-V Supply
    19. 6.19 Switching Characteristics—2.5-V Supply
    20. 6.20 Switching Characteristics—1.8-V Supply
    21. 6.21 Insulation Characteristics Curves
    22. 6.22 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20211018-SS0I-P36B-GKR4-B7R9RX98DX3S-low.gif Figure 5-1 ISO6760-Q1 DW Package16-Pin SOIC-WBTop View
GUID-20211018-SS0I-QRV6-G2M9-WG8FWJCGBSCF-low.gif Figure 5-2 ISO6761-Q1 DW Package16-Pin SOIC-WBTop View
GUID-20211018-SS0I-NG3Q-1ZJM-RTG2PBJC1VL9-low.gif Figure 5-3 ISO6762-Q1 DW Package16-Pin SOIC-WBTop View
GUID-20210611-CA0I-7NQN-VK0B-N8VWPNXTJFBG-low.gif Figure 5-4 ISO6763-Q1 DW Package16-Pin SOIC-WBTop View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
ISO6760-Q1 ISO6761-Q1 ISO6762-Q1 ISO6763-Q1
GND1 8 8 8 8 — Ground connection for VCC1
GND2 9 9 9 9 — Ground connection for VCC2
INA 2 2 2 2 I Input, channel A
INB 3 3 3 3 I Input, channel B
INC 4 4 4 4 I Input, channel C
IND 5 5 5 12 I Input, channel D
INE 6 6 11 11 I Input, channel E
INF 7 10 10 10 I Input, channel F
OUTA 15 15 15 15 O Output, channel A
OUTB 14 14 14 14 O Output, channel B
OUTC 13 13 13 13 O Output, channel C
OUTD 12 12 12 5 O Output, channel D
OUTE 11 11 6 6 O Output, channel E
OUTF 10 7 7 7 O Output, channel F
VCC1 1 1 1 1 — Power supply, side 1
VCC2 16 16 16 16 — Power supply, side 2