SLLSFN3 June   2022 ISO7041-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
    1.     Device Comparison Table
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6.     Insulation Specifications
    7. 6.6  Safety-Related Certifications
    8. 6.7  Safety Limiting Values
    9. 6.8  Electrical Characteristics 5V Supply
    10. 6.9  Supply Current Characteristics 5V Supply
    11. 6.10 Electrical Characteristics 3.3V Supply
    12. 6.11 Supply Current Characteristics 3.3V Supply
    13. 6.12 Switching Characteristics
    14. 6.13 Insulation Characteristics Curves
    15. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Refresh
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Insulation Lifetime
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The ISO7041-Q1 device is an ultra-low power, multichannel digital isolator that can be used to isolate CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. Innovative edge based architecture combined with an ON-OFF keying modulation scheme allows these isolators to consume very-low power while meeting 3000-VRMS isolation rating per UL1577. The per channel dynamic current consumption of the device is under 120 μA/Mbps and the per channel static current consumption is 3.5 μA at 3.3 V, allowing for use of the ISO7041-Q1 in both power and thermal constrained system designs.

The device can operate as low as 3.0 V, as high as 5.5 V, and is fully functional with different supply voltages on each side of isolation barrier. The four channel isolator comes in a 16-QSOP package with three forward-direction channels and one reverse-direction channel. The device has default output high and low options. If the input power or signal is lost, default output is high for the ISO7041-Q1 device without the suffix F and low for the ISO7041F-Q1 device with the F suffix. See the Device Functional Modes section for more information.

Device Information
PART NUMBER(1)PACKAGEBODY SIZE (NOM)
ISO7041-Q1QSOP (16)4.90 mm × 3.90 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-20210630-CA0I-L0GL-LBNT-8RTXCL3JD1JX-low.gif Simplified Application Schematic