SLLS629M January   2006  – October 2024 ISO721 , ISO721M , ISO722 , ISO722M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Safety Limiting Values
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Electrical Characteristics, 5 V, 3.3 V
    10. 6.10 Electrical Characteristics, 5 V
    11. 6.11 Switching Characteristics, 3.3 V, 5 V
    12. 6.12 Electrical Characteristics, 3.3 V, 5 V
    13. 6.13 Electrical Characteristics, 3.3 V
    14. 6.14 Switching Characteristics, 3.3 V
    15. 6.15 Switching Characteristics, 5 V, 3.3 V
    16. 6.16 Switching Characteristics, 5 V
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 Device I/O Schematic
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Characteristics Curves
        2. 9.2.3.2 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Detailed Design Procedure

Figure 9-2 shows a typical circuit hook-up for the ISO721 device.

ISO721 ISO721M ISO722 ISO722M Typical ISO721 Circuit Hook-upFigure 9-2 Typical ISO721 Circuit Hook-up

The ISO72x isolators have the same functional pinout as those of most other vendors as shown in Figure 9-3, and are often pin-for-pin drop-in replacements. The notable differences in the products are propagation delay, signaling rate, power consumption, and transient protection rating. Table 9-1 is used as a guide for replacing other isolators with the ISO72x family of single-channel isolators.

ISO721 ISO721M ISO722 ISO722M Pin Cross ReferenceFigure 9-3 Pin Cross Reference
Table 9-1 Cross Reference
ISOLATORPIN 1PIN 2PIN 3PIN 4PIN 5PIN 6PIN 7PIN 8
ISO721
OR
ISO721M		ISO722
OR
ISO722M
ISO721(1)(2)VCC1INVCC1GND1GND2OUTGND2ENVCC2
ADuM1100(1)(2)VDD1VIVDD1GND1GND2VOGND2VDD2
HCPL-xxxxVDD1VI*Leave Open(3)GND1GND2VONC(5)VDD2
IL710VDD1VINC(4)GND1GND2VOV OEVDD2
(1) Pin 1 must be used as VCC1. Pin 3 can also be used as VCC1 or left open, as long as pin 1 is connected to VCC1.
(2) Pin 5 must be used as GND2. Pin 7 can also be used as GND2 or left open, as long as pin 5 is connected to GND2.
(3) Pin 3 of the HCPL devices must be left open. This is not a problem when substituting an ISO72x device, because the extra VCC1 on pin 3 can be left an open circuit as well.
(4) Pin 3 of the IL710 must not be tied to ground on the circuit board because this shorts the ISO72x VCC1 to ground. The IL710 pin 3 can only be tied to VCC or left open to drop in an ISO72x device.
(5) An HCPL device pin 7 must be left floating (open) or grounded when an ISO722 or ISO722M device is to be used as a drop-in replacement. If pin 7 of the ISO722 or ISO722M device is placed in a high logic state, the output of the device is disabled.