SLLS918D July   2008  – November 2024 ISO721-Q1 , ISO722-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information
    4. 6.4  Power Ratings
    5. 6.5  Insulation Specifications
    6. 6.6  Safety-Related Certifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 5-V Operation
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 3.3-V Operation
    10. 6.10 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    11. 6.11 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    12. 6.12 Switching Characteristics: VCC1 and VCC2 5-V Operation
    13. 6.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
    14. 6.14 Switching Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    15. 6.15 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    16. 6.16 Typical Characteristics
    17. 6.17 Insulation Characteristics Curves
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 Device I/O Schematic
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current RθJA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C, see Thermal Information 124 mA
RθJA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C, see Thermal Information 190
TS Safety temperature 150 °C
(1) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.