SLLS867L September   2007  – October 2024 ISO7230C , ISO7231C , ISO7231M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 3.3 V
    10. 6.10 Electrical Characteristics: VCC1 and VCC2 at 5-V
    11. 6.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V
    12. 6.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    13. 6.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V
    14. 6.14 Switching Characteristics: VCC1 and VCC2 at 5-V
    15. 6.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V
    16. 6.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
        1. 9.2.3.1 Insulation Characteristics Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.17 Typical Characteristics

ISO7230C ISO7231C ISO7231M ISO7230C/M RMS Supply Current vs Signaling RateFigure 6-1 ISO7230C/M RMS Supply Current vs Signaling Rate
ISO7230C ISO7231C ISO7231M Propagation Delay vs Free-Air TemperatureFigure 6-3 Propagation Delay vs Free-Air Temperature
ISO7230C ISO7231C ISO7231M VCC1 Fail-Safe Threshold vs Free-Air TemperatureFigure 6-5 VCC1 Fail-Safe Threshold vs Free-Air Temperature
ISO7230C ISO7231C ISO7231M Low-Level Output Current vs Low-Level Output VoltageFigure 6-7 Low-Level Output Current vs Low-Level Output Voltage
ISO7230C ISO7231C ISO7231M ISO7231C/M RMS Supply Current vs Signaling RateFigure 6-2 ISO7231C/M RMS Supply Current vs Signaling Rate
ISO7230C ISO7231C ISO7231M Input Threshold Voltage vs Free-Air TemperatureFigure 6-4 Input Threshold Voltage vs Free-Air Temperature
ISO7230C ISO7231C ISO7231M High-Level Output Current vs High-Level Output VoltageFigure 6-6 High-Level Output Current vs High-Level Output Voltage