SLLS867L September   2007  – October 2024 ISO7230C , ISO7231C , ISO7231M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 3.3 V
    10. 6.10 Electrical Characteristics: VCC1 and VCC2 at 5-V
    11. 6.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V
    12. 6.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    13. 6.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V
    14. 6.14 Switching Characteristics: VCC1 and VCC2 at 5-V
    15. 6.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V
    16. 6.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
        1. 9.2.3.1 Insulation Characteristics Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay, low-to-high-level output ISO723xC See Figure 7-1 20 50 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 3
tPLH, tPHL Propagation delay, low-to-high-level output ISO723xM 8 29 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 1 2
tsk(pp) Part-to-part skew (2) ISO723xC 10 ns
ISO723xM 0 5
tsk(o) Channel-to-channel output skew (3) ISO723xC 0 2.5 ns
ISO723xM 0 1
tr Output signal rise time See Figure 7-1 2.4 ns
tf Output signal fall time 2.3
tPHZ Propagation delay, high-level-to-high-impedance output See Figure 7-2 15 25 ns
tPZH Propagation delay, high-impedance-to-high-level output 15 25
tPLZ Propagation delay, low-level-to-high-impedance output 15 25
tPZL Propagation delay, high-impedance-to-low-level output 15 25
tfs Failsafe output delay time from input power loss See Figure 7-3 18 μs
tjit(pp) Peak-to-peak eye-pattern jitter ISO723xM 150 Mbps PRBS NRZ data input, Same polarity input on all channels, See Figure 7-5 1 ns
(1) Also known as pulse skew
(2) tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
(3) tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads.