SLLSE71A September   2011  – November 2024 ISO7231C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Characteristics
    5. 4.5  Power Ratings
    6. 4.6  Insulation Specifications
    7. 4.7  Safety-Related Certifications
    8. 4.8  Safety Limiting Values
    9. 4.9  Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation
    10. 4.10 Electrical Characteristics: VCC1 and VCC2 at 5-V Operation
    11. 4.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    12. 4.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    13. 4.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
    14. 4.14 Switching Characteristics: VCC1 and VCC2 at 5-V Operation
    15. 4.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation
    16. 4.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    17. 4.17 Typical Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Function Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device I/O Schematics
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Insulation Characteristics Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Material
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θJA Junction-to-air Low-K Thermal Resistance(1) 168 °C/W
High-K Thermal Resistance 68.6
θJB Junction-to-Board Thermal Resistance 33.5 °C/W
θJC Junction-to-Case Thermal Resistance 33.9 °C/W
(1) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.