SLLS868U September   2007  – October 2024 ISO7240C , ISO7240CF , ISO7240M , ISO7241C , ISO7241M , ISO7242C , ISO7242M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics: VCC1 and VCC2 at 5-V Operation
    10. 5.10 Supply Current Characteristics: VCC1 and VCC2 at 5-V Operation
    11. 5.11 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    12. 5.12 Supply Current Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    13. 5.13 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    14. 5.14 Supply Current Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    15. 5.15 Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation
    16. 5.16 Supply Current Characteristics: VCC1 and VCC2 at 3.3 V Operation
    17. 5.17 Switching Characteristics: VCC1 and VCC2 at 5-V Operation
    18. 5.18 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    19. 5.19 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation
    20. 5.20 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
    21. 5.21 Insulation Characteristics Curves
    22. 5.22 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Isolated Data Acquisition System for Process Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Isolated SPI for an Analog Input Module with 16 Inputs
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Isolated RS-232 Interface
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Related Links
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.17 Switching Characteristics: VCC1 and VCC2 at 5-V Operation

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay ISO724xC See Figure 6-1 18 42 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 2.5
tPLH, tPHL Propagation delay ISO724xM 8 23 ns
PWD Pulse-width distortion(1) |tPHL – tPLH| 1 2
tsk(pp) Part-to-part skew (2) ISO724xC 8 ns
ISO724xM 0 3
tsk(o) Channel-to-channel output skew (3) ISO724xC 2 ns
ISO724xM 0 1
tr Output signal rise time See Figure 6-1 2.4 ns
tf Output signal fall time 2.3
tPHZ Propagation delay, high-level-to-high-impedance output See Figure 6-2 15 25 ns
tPZH Propagation delay, high-impedance-to-high-level output 15 25
tPLZ Propagation delay, low-level-to-high-impedance output 15 25
tPZL Propagation delay, high-impedance-to-low-level output 15 25
tfs Failsafe output delay time from input power loss See Figure 6-3 12 μs
twake Wake time from input disable See Figure 6-4 15 μs
tjit(pp) Peak-to-peak eye-pattern jitter ISO724xM 150 Mbps NRZ data input, Same polarity input on all channels, See Figure 6-6 1 ns
(1) Also referred to as pulse skew.
(2) tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
(3) tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads.