SLLSER7 November   2015 ISO7330-Q1 , ISO7331-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics—5-V Supply
    6. 6.6  Supply Current Characteristics—5-V Supply
    7. 6.7  Electrical Characteristics—3.3-V Supply
    8. 6.8  Supply Current Characteristics—3.3-V Supply
    9. 6.9  Power Dissipation Characteristics
    10. 6.10 Switching Characteristics—5-V Supply
    11. 6.11 Switching Characteristics—3.3-V Supply
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Voltage Feature Description
        1. 8.3.1.1 Package Insulation Specifications
        2. 8.3.1.2 Insulation Characteristics
        3. 8.3.1.3 Regulatory Information
        4. 8.3.1.4 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Typical Supply Current Equations
          1. 9.2.1.1.1 ISO7330-Q1
          2. 9.2.1.1.2 ISO7321-Q1
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 9.2.3 Application Curves
      4. 9.2.4 Systems Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

ISO7330-Q1 DW Package
16-Pin SOIC
Top View
ISO7330-Q1 ISO7331-Q1 po_iso7330C_sllsek9.gif
ISO7331-Q1 DW Package
16-Pin SOIC
Top View
ISO7330-Q1 ISO7331-Q1 po_iso7331C_sllsek9.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ISO7330-Q1 ISO7331-Q1
EN 10 — I Output enable. OUTA, OUTB, and OUTC are enabled when EN is high or disconnected and disabled when EN is low.
EN1 — 7 I Output enable 1. OUTC is enabled when EN1 is high or disconnected and disabled when EN1 is low.
EN2 — 10 I Output enable 2. OUTA and OUTB are enabled when EN2 is high or disconnected and disabled when EN2 is low.
GND1 2 2 — Ground connection for VCC1
8 8
GND2 9 9 — Ground connection for VCC2
15 15
INA 3 3 I Input, channel A
INB 4 4 I Input, channel B
INC 5 12 I Input, channel C
NC 6 6 — No Connect. These pins have no internal connection.
7
11 11
OUTA 14 14 O Output, channel A
OUTB 13 13 O Output, channel B
OUTC 12 5 O Output, channel C
VCC1 1 1 — Power supply, VCC1
VCC2 16 16 — Power supply, VCC2