SLLSED3C June   2013  – July 2015 ISO7420FCC

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC1 and VCC2 = 5 V ± 10%
    6. 6.6  Electrical Characteristics: VCC1 and VCC2 = 3.3 V ± 10%
    7. 6.7  Electrical Characteristics: VCC1 and VCC2 = 2.7 V
    8. 6.8  Power Dissipation Characteristics
    9. 6.9  Switching Characteristics: VCC1 and VCC2 = 5 V ± 10%
    10. 6.10 Switching Characteristics: VCC1 and VCC2 = 3.3 V ± 10%
    11. 6.11 Switching Characteristics: VCC1 and VCC2 = 2.7 V
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Insulation and Safety-Related Specifications for SOIC-8 Package
      2. 8.3.2 Insulation Characteristics
      3. 8.3.3 Regulatory Information
      4. 8.3.4 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Supply Current Equations
          1. 9.2.2.1.1 Maximum Supply Current Equations
          2. 9.2.2.1.2 Typical Supply Current Equations
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (January 2014) to C Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • VDE standard changed to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 Go
  • Changed VDE standard changed to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Go
  • Changed Note 1 Figure 12Go
  • Changed Figure 13Go

Changes from A Revision (July 2013) to B Revision

  • Changed the SAFETY AND REGULATORY APPROVALS listGo
  • Changed the VIH MAX value From: VCC To: 5.5V in the RECOMMENDED OPERATING CONDITIONS table Go
  • Changed the VPR and VIOTM parameter From: DIN EN 60747-5-2 To: DIN EN 60747-5-5 in the INSULATION CHARACTERISTICS tableGo
  • Changed the REGULATORY INFORMATION tableGo
  • Changed the title of Figure 16 From: θJC Thermal Derating Curve per DIN EN 60747-5-2 To: θJC Thermal Derating Curve per DIN EN 60747-5-5Go

Changes from * Revision (June 2013) to A Revision

  • Changed High-level output voltage MIN Value From: VCCx To: VCC2Go
  • Changed High-level output voltage MIN Value From: VCCx To: VCC2 and removed Note 1Go
  • Changed High-level output voltage MIN Value From: VCCx To: VCC2 and removed Note 1Go
  • Changed Figure 3 X axis valuesGo