SLLSEN3 December   2015 ISO7421-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC1 and VCC2 at 5 V ±10%
    6. 6.6  Electrical Characteristics: VCC1 at 5 V ±10%, VCC2 at 3.3 V ±10%
    7. 6.7  Electrical Characteristics: VCC1 at 3.3 V ±10%, VCC2 at 5 V ±10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    9. 6.9  Power Dissipation
    10. 6.10 Switching Characteristics: VCC1 and VCC2 at 5 V ±10%
    11. 6.11 Switching Characteristics: VCC1 at 5 V ±10%, VCC2 at 3.3 V ±10%
    12. 6.12 Switching Characteristics: VCC1 at 3.3 V ±10%, VCC2 at 5 V ±10%
    13. 6.13 Switching Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Insulation Characteristics
      2. 8.3.2 Package Characteristics
      3. 8.3.3 Safety Limiting Values
      4. 8.3.4 Regulatory Information
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

D Package
8-Pin SOIC
Top View
ISO7421-EP po_iso7421_lls984.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
GND1 4 — Ground connection for VCC1
GND2 5 — Ground connection for VCC2
INA 7 I Input, channel A
INB 3 I Input, channel B
OUTA 2 O Output, channel A
OUTB 6 O Output, channel B
VCC1 1 — Power supply, VCC1
VCC2 8 — Power supply, VCC2