SLLSE45F December   2010  – July 2015 ISO7420E , ISO7420FE , ISO7421E , ISO7421FE

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC1 and VCC2 = 5 V ± 10%
    6. 6.6  Electrical Characteristics: VCC1 = 5 V ± 10%, VCC2 = 3.3 V ± 10%
    7. 6.7  Electrical Characteristics: VCC1 = 3.3 V ± 10%, VCC2 = 5 V ± 10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 = 3.3 V ± 10%
    9. 6.9  Power Dissipation Characteristics
    10. 6.10 Switching Characteristics: VCC1 and VCC2 = 5 V ± 10%
    11. 6.11 Switching Characteristics: VCC1 = 5 V ± 10%, VCC2 = 3.3 V ± 10%
    12. 6.12 Switching Characteristics: VCC1 = 3.3 V ± 10%, VCC2 = 5 V ± 10%
    13. 6.13 Switching Characteristics: VCC1 and VCC2 = 3.3 V ± 10%
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Insulation and Safety-Related Specifications for D-8 Package
      2. 8.3.2 Insulation Characteristics
      3. 8.3.3 Regulatory Information
      4. 8.3.4 Life Expectancy vs Working Voltage
      5. 8.3.5 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematic
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Supply Current Equations
          1. 9.2.2.1.1 ISO7420
          2. 9.2.2.1.2 ISO7421
        2. 9.2.2.2 Typical Supply Current Equations:
          1. 9.2.2.2.1 ISO7420
          2. 9.2.2.2.2 ISO7421
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.