SLLSEU1C March   2017  – December 2023 ISO7720-Q1 , ISO7721-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
    2. 13.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DWV|8
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) ISO772x-Q1 UNIT
DW (SOIC) DWV (SOIC) D (SOIC)
16 PINS 16 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 86.5 84.3 137.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.6 36.3 54.9 °C/W
RθJB Junction-to-board thermal resistance 49.7 47.0 71.7 °C/W
ψJT Junction-to-top characterization parameter 32.3 7.4 7.1 °C/W
ψJB Junction-to-board characterization parameter 49.2 45.1 70.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.