SLLSEP3G November   2016  – May 2024 ISO7720 , ISO7721

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DWV|8
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DW-16 PACKAGE
IS Safety input, output, or supply current RθJA =86.5°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C,  see Figure 6-1 263 mA
RθJA = 86.5°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 6-1 401
RθJA = 86.5°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 6-1 525
PS Safety input, output, or total power RθJA = 86.5°C/W, TJ = 150°C, TA = 25°C, see Figure 6-2 1445 mW
TS Maximum safety temperature 150 °C
DWV-8 PACKAGE
IS Safety input, output, or supply current (1) RθJA =84.3°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 6-3 270 mA
RθJA = 84.3°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 6-3 412
RθJA = 84.3°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 6-3 539
PS Safety input, output, or total power (1) RθJA = 84.3°C/W, TJ = 150°C, TA = 25°C, see Figure 6-4 1483 mW
TS Maximum safety temperature (1) 150 °C
D-8 PACKAGE
IS Safety input, output, or supply current (1) RθJA =137.7°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 6-5 165 mA
RθJA = 137.7°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 6-5 252
RθJA = 137.7°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 6-5 330
PS Safety input, output, or total power (1) RθJA = 137.7°C/W, TJ = 150°C, TA = 25°C, see Figure 6-6 908 mW
TS Maximum safety temperature (1) 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in Section 6.4 is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.