SLLSEU1C March   2017  – December 2023 ISO7720-Q1 , ISO7721-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
    2. 13.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DWV|8
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-2E8FD3BB-721F-4AD6-920E-ACBE0DAAF83F-low.gifFigure 5-1 ISO7720-Q1 DW Package16-Pin SOICTop View
GUID-D58BB35B-1B49-4515-894F-26071F9442DB-low.gifFigure 5-2 ISO7721-Q1 DW Package16-Pin SOICTop View
GUID-A4334466-4734-4C55-9156-141DB4C54538-low.gifFigure 5-3 ISO7720-Q1 D and DWV Package8-Pin SOICTop View
GUID-1EEAEFEF-9496-4E4D-8AAA-550F580DCDB3-low.gifFigure 5-4 ISO7721-Q1 D and DWV Package8-Pin SOICTop View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME DW PACKAGE D, DWV PACKAGE
ISO7720-Q1 ISO7721-Q1 ISO7720-Q1 ISO7721-Q1
GND1 1, 7 1, 7 4 4 — Ground connection for VCC1
GND2 9 9 5 5 — Ground connection for VCC2
16 16
INA 4 13 2 7 I Input, channel A
INB 5 5 3 3 I Input, channel B
NC 2, 6, 8, 10, 11, 15 2, 6, 8, 10, 11, 15 — — — Not connected
OUTA 13 4 7 2 O Output, channel A
OUTB 12 12 6 6 O Output, channel B
VCC1 3 3 1 1 — Power supply, VCC1
VCC2 14 14 8 8 — Power supply, VCC2