SLLSES0J September   2016  – October 2024 ISO7730 , ISO7731

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply 
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Insulation Lifetime
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision I (August 2023) to Revision J (October 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated distance through isolation, while maintaining other insulation specificationsGo
  • Updated the input leakage current for ENx pins throughout the electrical characteristic sections Go
  • Updated the TDDB plot and the projected lifetimeGo
  • Deleted the Community Resources section and added the Support Resources sectionGo

Changes from Revision H (March 2023) to Revision I (August 2023)

  • Updated Thermal Characteristics, Safety Limiting Values, and Thermal Derating Curves to provide more accurate system-level thermal calculationsGo
  • Updated electrical and switching characteristics to match device performanceGo

Changes from Revision G (March 2020) to Revision H (March 2023)

  • Changed standard name from: "DIN V VDE V 0884-11:2017-01" to: "DIN EN IEC 60747-17 (VDE 0884-17)" throughout the documentGo
  • Removed references to standard IEC/EN/CSA 60950-1 throughout the document Go
  • Removed standard revision and year references from all standard names throughout the documentGo
  • Added Maximum impulse voltage (VIMP) specification per DIN EN IEC 60747-17 (VDE 0884-17)Go
  • Changed test conditions and values of Maximum surge isolation voltage (VIOSM) specification per DIN EN IEC 60747-17 (VDE 0884-17)Go
  • Clarified method b test conditions of Apparent charge (qPD)Go
  • Changed values of Maximum surge isolation voltage (VIOSM) specification per DIN EN IEC 60747-17 (VDE 0884-17)Go