SLLSEU3F November   2016  – October 2024 ISO7730-Q1 , ISO7731-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply 
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Related Links
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

ISO7730-Q1 ISO7731-Q1 ISO7730-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View Figure 4-1 ISO7730-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View
ISO7730-Q1 ISO7731-Q1 ISO7731-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View Figure 4-2 ISO7731-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View
Table 4-1 Pin Functions
PIN Type(1) DESCRIPTION
NAME NO.
ISO7730-Q1 ISO7731-Q1
EN1 — 7 I Output enable 1. Output pins on side 1 are enabled when EN1 is high or open and in high-impedance state when EN1 is low.
EN2 10 10 I Output enable 2. Output pins on side 2 are enabled when EN2 is high or open and in high-impedance state when EN2 is low.
GND1 2, 8 2, 8 — Ground connection for VCC1
GND2 9, 15 9, 15 — Ground connection for VCC2
INA 3 3 I Input, channel A
INB 4 4 I Input, channel B
INC 5 12 I Input, channel C
NC 6, 7, 11 6, 11 — Not connected
OUTA 14 14 O Output, channel A
OUTB 13 13 O Output, channel B
OUTC 12 5 O Output, channel C
VCC1 1 1 — Power supply, VCC1
VCC2 16 16 — Power supply, VCC2
(1) I = Input; O = Output