SLLSEU0F November   2016  – August 2023 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply 
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

ISO7740-Q1 ISO7741-Q1 ISO7742-Q1 ISO7740-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View Figure 4-1 ISO7740-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View
ISO7740-Q1 ISO7741-Q1 ISO7742-Q1 ISO7741-Q1 DWW, DW and DBQ Packages 16-Pin SOIC-Extra-WB, SOIC-WB and QSOP Top View Figure 4-2 ISO7741-Q1 DWW, DW and DBQ Packages 16-Pin SOIC-Extra-WB, SOIC-WB and QSOP Top View
ISO7740-Q1 ISO7741-Q1 ISO7742-Q1 ISO7742-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View Figure 4-3 ISO7742-Q1 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME ISO7740-Q1 ISO7741-Q1 ISO7742-Q1
EN1 — 7 7 I Output enable 1. Output pins on side 1 are enabled when EN1 is high or open and in high-impedance state when EN1 is low.
EN2 10 10 10 I Output enable 2. Output pins on side 2 are enabled when EN2 is high or open and in high-impedance state when EN2 is low.
GND1 2 2 2 — Ground connection for VCC1
8 8 8
GND2 9 9 9 — Ground connection for VCC2
15 15 15
INA 3 3 3 I Input, channel A
INB 4 4 4 I Input, channel B
INC 5 5 12 I Input, channel C
IND 6 11 11 I Input, channel D
NC 7 — — — Not connected
OUTA 14 14 14 O Output, channel A
OUTB 13 13 13 O Output, channel B
OUTC 12 12 5 O Output, channel C
OUTD 11 6 6 O Output, channel D
VCC1 1 1 1 — Power supply, side 1
VCC2 16 16 16 — Power supply, side 2