SLLSFB3C September   2019  – February 2024 ISO7741E-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Rating
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISSafety input, output, or supply currentRθJA = 83.4 °C/W, VI = 5.5 V, TJ = 175°C, TA = 25°C, see Figure 5-1327mA
RθJA = 83.4 °C/W, VI = 3.6 V, TJ = 175°C, TA = 25°C, see Figure 5-1500
RθJA = 83.4 °C/W, VI = 2.75 V, TJ = 175°C, TA = 25°C, see Figure 5-1654
PSSafety input, output, or total powerRθJA = 83.4 °C/W, TJ = 175°C, TA = 25°C, see Figure 5-21799mW
TSMaximum safety temperature175°C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.