SLLSFW9A April   2024  – July 2024 ISO7741TA-Q1 , ISO7741TB-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics Transformer
    10. 5.10 Electrical Characteristics—5V Supply
    11. 5.11 Supply Current Characteristics—5V Supply
    12. 5.12 Electrical Characteristics—3.3V Supply
    13. 5.13 Supply Current Characteristics—3.3V Supply
    14. 5.14 Electrical Characteristics—2.5V Supply 
    15. 5.15 Supply Current Characteristics—2.5V Supply
    16. 5.16 Switching Characteristics—5V Supply
    17. 5.17 Switching Characteristics—3.3V Supply
    18. 5.18 Switching Characteristics—2.5V Supply
    19. 5.19 Insulation Characteristics Curves
    20. 5.20 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 7.3.2 Push-Pull Converter
      3. 7.3.3 Core Magnetization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
      2. 7.4.2 Start-Up Mode
      3. 7.4.3 Operating Mode
      4. 7.4.4 Spread Spectrum Clocking
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Drive Capability
        2. 8.2.2.2 LDO Selection
        3. 8.2.2.3 Diode Selection
        4. 8.2.2.4 Capacitor Selection
        5. 8.2.2.5 Transformer Selection
          1. 8.2.2.5.1 V-t Product Calculation
          2. 8.2.2.5.2 Turns Ratio Estimate
          3. 8.2.2.5.3 Recommended Transformers
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
      4. 8.2.4 System Examples
        1. 8.2.4.1 Higher Output Voltage Designs
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DW-16 PACKAGE
IS Safety input, output, or supply current RθJA = 64°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C, IL = 700mA see Figure 5-1 319 mA
RθJA = 64°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C, IL = 700mA  see Figure 5-1 480
RθJA = 64°C/W, VI = 2.75V, TJ = 150°C, TA = 25°C, IL = 700mA  see Figure 5-1 630
PS Safety input, output, or total power RθJA = 64°C/W, TJ = 150°C, TA = 25°C see Figure 5-2 1953 mW
TS Maximum safety temperature 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS must not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in Section 5.4 is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.