SLLSEU0F November 2016 – January 2024 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | ISO774x-Q1 | UNIT | |||
---|---|---|---|---|---|
DWW (SOIC) | DW (SOIC) | DBQ (QSOP) | |||
16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 58.3 | 83.4 | 109 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 21.4 | 46 | 54.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 30.5 | 48 | 51.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 7.1 | 19.1 | 14.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 29.8 | 47.5 | 51.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | °C/W |