SLLSEU7E November   2018  – July 2024 ISO7760-Q1 , ISO7761-Q1 , ISO7762-Q1 , ISO7763-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (Continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   Parameter Measurement Information
  9. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  10. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Insulation Lifetime
  11. Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  14. 12Revision History
  15. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient temperature range
    • Device HBM ESD classification level 3A
    • Device CDM ESD classification level C6
  • Functional Safety-Capable
  • 100Mbps data rate
  • Robust isolation barrier:
    • >30-Year projected lifetime
    • Up to 5000VRMS isolation rating
    • Up to 12.8kV surge capability
    • ±100kV/μs Typical CMTI
  • Wide supply range: 2.25V to 5.5V
  • 2.25V to 5.5V Level translation
  • Default output high (ISO776x) and low (ISO776xF) Options
  • Low power consumption, typical 1.4mA per channel at 1Mbps
  • Low propagation delay: 11ns typical at 5V
  • Robust Electromagnetic Compatibility (EMC):
    • System-level ESD, EFT, and surge immunity
    • ±8kV IEC 61000-4-2 Contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16) and SSOP (DBQ-16) package options
  • Safety-related certifications:
    • Reinforced insulation per DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • CSA certification per IEC 62368-1 and IEC 60601-1
    • CQC certification per GB4943.1
    • TUV certification according to EN 62368-1 and EN 61010-1