SLLSEU7E November   2018  – July 2024 ISO7760-Q1 , ISO7761-Q1 , ISO7762-Q1 , ISO7763-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (Continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   Parameter Measurement Information
  9. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  10. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Insulation Lifetime
  11. Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  14. 12Revision History
  15. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The ISO776x-Q1 devices are high-performance, six-channel digital isolators with 5000VRMS (DW package) and 3000VRMS (DBQ package) isolation ratings per UL 1577. This family of devices is also certified according to VDE, CSA, TUV and CQC.

The ISO776x-Q1 family of devices provides high-electromagnetic immunity and low emissions at low-power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic-input and logic-output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. The ISO776x-Q1 family of devices is available in all possible pin configurations such that all six channels are in the same direction, or one, two, or three channels are in reverse direction while the remaining channels are in forward direction. If the input power or signal is lost, the default output is high for devices without suffix F and low for devices with suffix F. See the Device Functional Modes section for further details.

Package Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM) PACKAGE SIZE(2)
ISO7760-Q1
ISO7761-Q1
ISO7762-Q1
IOS7763-Q1
SOIC (DW, 16) 10.30mm × 7.50mm 10.3mm × 10.30mm
SSOP (DBQ, 16) 4.90mm × 3.90mm 4.90mm × 6.00mm
For more information, see Section 13.
The package size (length × width) is a nominal value and includes pins, where applicable.
ISO7760-Q1 ISO7761-Q1 ISO7762-Q1 ISO7763-Q1 Simplified Schematic
VCCI=Input VCC, VCCO=Output VCC
GNDI=Input ground, GNDO=Output ground
Simplified Schematic