SLLSEU7E
November 2018 – July 2024
ISO7760-Q1
,
ISO7761-Q1
,
ISO7762-Q1
,
ISO7763-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Description (Continued)
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Ratings
6.6
Insulation Specifications
6.7
Safety-Related Certifications
6.8
Safety Limiting Values
6.9
Electrical Characteristics—5-V Supply
6.10
Supply Current Characteristics—5-V Supply
6.11
Electrical Characteristics—3.3-V Supply
6.12
Supply Current Characteristics—3.3-V Supply
6.13
Electrical Characteristics—2.5-V Supply
6.14
Supply Current Characteristics—2.5-V Supply
6.15
Switching Characteristics—5-V Supply
6.16
Switching Characteristics—3.3-V Supply
6.17
Switching Characteristics—2.5-V Supply
6.18
Insulation Characteristics Curves
6.19
Typical Characteristics
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Electromagnetic Compatibility (EMC) Considerations
7.4
Device Functional Modes
7.4.1
Device I/O Schematics
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.2.3.1
Insulation Lifetime
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
PCB Material
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Related Links
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DW|16
MSOI003I
DBQ|16
MSOI004H
Thermal pad, mechanical data (Package|Pins)
DW|16
QFND505A
Orderable Information
sllseu7e_oa
sllseu7e_pm
7.4.1
Device I/O Schematics
Figure 7-3
Device I/O Schematics