SLLSEJ0H October   2014  – March 2024 ISO7842

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics–5V Supply
    10. 5.10 Supply Current Characteristics–5V Supply
    11. 5.11 Electrical Characteristics—3.3V Supply
    12. 5.12 Supply Current Characteristics—3.3V Supply
    13. 5.13 Electrical Characteristics—2.5V Supply
    14. 5.14 Supply Current Characteristics—2.5V Supply
    15. 5.15 Switching Characteristics—5V Supply
    16. 5.16 Switching Characteristics—3.3V Supply
    17. 5.17 Switching Characteristics—2.5V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device I/O Schematics
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  10. 8 Power Supply Recommendations
  11. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 PCB Material
    2. 9.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.19 Typical Characteristics

GUID-114E2F44-85E8-4BB3-9415-26905FFF42A5-low.gif
TA = 25°CCL = 15pF
Figure 5-5 Supply Current vs Data Rate (With 15-pF Load)
GUID-39E1170D-0A40-495C-8442-6F86C94F119E-low.gif
TA = 25°C
Figure 5-7 High-Level Output Voltage vs High-level Output Current
GUID-46FC0A1A-B299-4851-8F50-6BD629F7D881-low.gif
Figure 5-9 Power Supply Undervoltage Threshold vs Free-Air Temperature
GUID-468AECE4-16EA-4793-ADE9-8DCB22FDBC98-low.gif
TA = 25°CCL = No Load
Figure 5-6 Supply Current vs Data Rate (With No Load)
GUID-B2138DAF-16EC-4D5D-995B-2B38C58FE220-low.gif
TA = 25°C
Figure 5-8 Low-Level Output Voltage vs Low-Level Output Current
GUID-A927E6DF-6CC2-420E-ADFA-EB31D5B89FDA-low.gif
Figure 5-10 Propagation Delay Time vs Free-Air Temperature