SLLSEJ0H October   2014  – March 2024 ISO7842

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics–5V Supply
    10. 5.10 Supply Current Characteristics–5V Supply
    11. 5.11 Electrical Characteristics—3.3V Supply
    12. 5.12 Supply Current Characteristics—3.3V Supply
    13. 5.13 Electrical Characteristics—2.5V Supply
    14. 5.14 Supply Current Characteristics—2.5V Supply
    15. 5.15 Switching Characteristics—5V Supply
    16. 5.16 Switching Characteristics—3.3V Supply
    17. 5.17 Switching Characteristics—2.5V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device I/O Schematics
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  10. 8 Power Supply Recommendations
  11. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 PCB Material
    2. 9.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.15 Switching Characteristics—5V Supply

VCC1 = VCC2 = 5V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tPLH, tPHLPropagation delay timeSee Figure 6-161116ns
PWDPulse width distortion(1) |tPHL – tPLH|0.554.1ns
tsk(o)Channel-to-channel output skew time(2)Same-direction channels2.5ns
tsk(pp)Part-to-part skew time(3)4.5ns
trOutput signal rise timeSee Figure 6-11.73.9ns
tfOutput signal fall time1.93.9ns
tPHZDisable propagation delay, high-to-high impedance outputSee Figure 6-21220ns
tPLZDisable propagation delay, low-to-high impedance output1220ns
tPZHEnable propagation delay, high impedance-to-high output for ISO78421020ns
Enable propagation delay, high impedance-to-high output for ISO7842F22.5μs
tPZLEnable propagation delay, high impedance-to-low output for ISO784222.5μs
Enable propagation delay, high impedance-to-low output for ISO7842F1020ns
tfsDefault output delay time from input power lossMeasured from the time VCC goes below 1.7 V. See Figure 6-30.29μs
tieTime interval error216 – 1 PRBS data at 100 Mbps0.90ns
(1) Also known as pulse skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.