SLLSEJ0H October   2014  – March 2024 ISO7842

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics–5V Supply
    10. 5.10 Supply Current Characteristics–5V Supply
    11. 5.11 Electrical Characteristics—3.3V Supply
    12. 5.12 Supply Current Characteristics—3.3V Supply
    13. 5.13 Electrical Characteristics—2.5V Supply
    14. 5.14 Supply Current Characteristics—2.5V Supply
    15. 5.15 Switching Characteristics—5V Supply
    16. 5.16 Switching Characteristics—3.3V Supply
    17. 5.17 Switching Characteristics—2.5V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device I/O Schematics
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  10. 8 Power Supply Recommendations
  11. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 PCB Material
    2. 9.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Overview

The ISO7842 device uses an ON-OFF keying (OOK) modulation scheme to transmit the digital data across a silicon-dioxide based isolation barrier. The transmitter sends a high-frequency carrier across the barrier to represent one digital state and sends no signal to represent the other digital state. The receiver demodulates the signal after advanced signal conditioning and produces the output through a buffer stage. If the EN pin is low then the output goes to high impedance. The ISO7842 device also incorporates advanced circuit techniques to maximize the CMTI performance and minimize the radiated emissions because of the high-frequency carrier and IO buffer switching. The conceptual block diagram of a digital capacitive isolator, Figure 6-1, shows a functional block diagram of a typical channel.