SLLSFS9C September   2023  – October 2024 ISOM8110 , ISOM8111 , ISOM8112 , ISOM8113 , ISOM8115 , ISOM8116 , ISOM8117 , ISOM8118

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Insulation Specifications
    5. 6.5 Safety-Related Certifications
    6. 6.6 Safety Limiting Values
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Design Requirements
        2. 9.1.1.2 Detailed Design Procedure
          1. 9.1.1.2.1 Sizing RPULLUP
          2. 9.1.1.2.2 Sizing RIN
        3. 9.1.1.3 Application Curves
    2. 9.2 Power Supply Recommendations
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
      3. 9.3.3 Reflow Profile
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.3 Reflow Profile

Many traditional optocouplers have limits on the peak temperature of reflow soldering due to device construction. Opto-emulators benefit from TI's packaging technology and can withstand up to three reflow cycles. These integrated circuit packages are classified for moisture and reflow temperature sensitivity according to the current IPC/JEDEC J-STD-020 standard.

The peak reflow temperature is specified according to the package thickness and plastic volume. The Pb-Free Process-Classification Temperatures (Tc) table in the IPC/JEDEC J-STD-020 standard lists the temperatures for lead-free processes, which are shown in Table 9-2.

Table 9-2 Peak Reflow Classification (Tc) Based on Package Dimensions
Package Thickness Volume < 350mm3 Volume 350 – 2000mm3 Volume >2000mm3
< 1.6mm 260°C 260°C 260°C
1.6mm – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C

The reflow profile shown in Figure 9-8 can be used with a typical range for the customer peak reflow temperature (Tp) of 235°C to 250°C. The peak reflow temperature (Tp) must not exceed the classification reflow temperature (Tc) shown in Table 9-2 and Figure 9-8.


ISOM8110 ISOM8111 ISOM8112 ISOM8113 ISOM8115 ISOM8116 ISOM8117 ISOM8118 TI Representation of the J-STD-020 Classification Profile (not to scale)
Figure 9-8 TI Representation of the J-STD-020 Classification Profile (not to scale)

For additional details, please refer to MSL Ratings and Reflow Profiles.