SLLSFS9C September   2023  – October 2024 ISOM8110 , ISOM8111 , ISOM8112 , ISOM8113 , ISOM8115 , ISOM8116 , ISOM8117 , ISOM8118

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Insulation Specifications
    5. 6.5 Safety-Related Certifications
    6. 6.6 Safety Limiting Values
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Design Requirements
        2. 9.1.1.2 Detailed Design Procedure
          1. 9.1.1.2.1 Sizing RPULLUP
          2. 9.1.1.2.2 Sizing RIN
        3. 9.1.1.3 Application Curves
    2. 9.2 Power Supply Recommendations
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
      3. 9.3.3 Reflow Profile
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SO-4 PACKAGE (DFG)
IS Safety limiting input current RθJA= 283.9℃/W, VF = 1.4V, TJ = 150℃, TA = 25℃ 300 mA
RθJA=283.9℃/W, VCEO = 40V, TJ = 150℃, TA = 25℃ 10.5 mA
RθJA= 283.9℃/W, VCEO = 24V, TJ =150℃, TA = 25℃ 17.5 mA
RθJA= 283.9℃/W, VCEO = 15V, TJ = 150℃, TA = 25℃ 28 mA
PS Safety limiting total power RθJA= 283.9℃/W, TJ = 150℃, TA = 25℃ 420 mW
TS Maximum safety temperature 150 ℃
SO-4 PACKAGE (DFH)
IS Safety limiting input current RθJA= 288.8℃/W, VF = 1.4V, TJ = 150℃, TA = 25℃ 300 mA
IS Safety limiting input current RθJA=288.8℃/W, VCEO = 40V, TJ = 150℃, TA = 25℃ 10.5 mA
IS Safety limiting input current RθJA= 288.8℃/W, VCEO = 24V, TJ =150℃, TA = 25℃ 17.5 mA
IS Safety limiting input current RθJA= 288.8℃/W, VCEO = 15V, TJ = 150℃, TA = 25℃ 28 mA
PS Safety limiting total power RθJA= 288.8℃/W, TJ = 150℃, TA = 25℃ 420 mW
TS Maximum safety temperature 150 ℃
(1) The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS must not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.