SNIS234A October   2023  – June 2024 ISOTMP35-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Insulation Specification
    6. 5.6  Power Ratings
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Features Description
      1. 6.3.1 Integrated Isolation Barrier and Thermal Response
      2. 6.3.2 Analog Output
        1. 6.3.2.1 Common Mode Transient Immunity (CMTI)
      3. 6.3.3 Thermal Response
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Voltage Linearity
      2. 7.1.2 Load Regulation
      3. 7.1.3 Start-Up Settling Time
      4. 7.1.4 Thermal Response
      5. 7.1.5 External Buffer
      6. 7.1.6 ADC Selection and Impact on Accuracy
      7. 7.1.7 Implementation Guidelines
      8. 7.1.8 PSRR
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Insulation Lifetime
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DFQ|7
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.9 Electrical Characteristics

Over free-air temperature range and VDD = 2.3V to 5.5V (unless otherwise noted); Typical specifications are at TA = 25°C and VDD = 3.3V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE SENSOR
TERR Temperature accuracy 0°C to 70°C –1.5 ±0.5 1.5 °C
TERR Temperature accuracy -40°C to 150°C –2.5 ±0.5 2.5 °C
PSR DC power supply rejection  –0.1  0.02  0.1  °C/V
TSENS Temperature sensitivity TA = -40°C to 150°C 10.00 mV/°C
TLTD Long-term drift(1) 300 hours at 150°C, 5.5V .05  °C
VOUT Output voltage TA = 0°C 500 mV
TA = 25°C 750 mV
NL Nonlinearity TA = –40°C to 150°C 0.5 °C
tRESP_D Directional Response time 2-layer 62-mil Rigid PCB
2oz. Copper		 τ = 63 %
TSENSE = 25°C to 75°C
Pins 1 to 4 = 25°C		 1600  ms
tRESP_L Response time (Stirred Liquid) 0.5in x 0.5in,
2-layer 62-mil PCB		 τ = 63 %
25°C to 150°C		 1600  ms
ANALOG OUTPUT
ZOUT Output impedance ILOAD = 100μA, f = 100Hz 20 Ω
ILOAD = 100μA, f = 500Hz 50 Ω
IOUT Output current 500 μA
CMTI Common Mode Transient Immunity  VCM= 500V, ΔVOUT < 200mV, 2μs, CLOAD= 1nF, RLOAD = 5kΩ 50 kV/μs
LR Load regulation ILOAD = 0 μA to 500 μA  6 mV
CL Maximum capacitive load 1 nF
POWER SUPPLY
IDD Operating current VDD = 3.3V
TA = 25°C		 10 12 μA
TA = –40°C to 150°C 17 μA
(1) Long term stability is determined using accelerated operational life testing at a junction temperature of 150°C.