SLLSFW6 March   2024 ISOUSB211-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply Options
      2. 7.3.2  Power Up
      3. 7.3.3  Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 7.3.4  Connect and Speed Detection
      5. 7.3.5  Disconnect Detection
      6. 7.3.6  Reset
      7. 7.3.7  LS/FS Message Traffic
      8. 7.3.8  HS Message Traffic
      9. 7.3.9  Equalization and Pre-emphasis
      10. 7.3.10 L2 Power Management State (Suspend) and Resume
      11. 7.3.11 L1 Power Management State (Sleep) and Resume
      12. 7.3.12 HS Test Mode Support
      13. 7.3.13 CDP Advertising
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Isolated Host or Hub
      2. 8.1.2 Isolated Peripheral - Self-Powered
      3. 8.1.3 Isolated Peripheral - Bus-Powered
      4. 8.1.4 Application Curve
        1. 8.1.4.1 Insulation Lifetime
    2. 8.2 Meeting USB2.0 HS Eye-Diagram Specifications
    3. 8.3 Thermal Considerations
      1. 8.3.1 VBUS / V3P3V Power
      2. 8.3.2 VCCx / V1P8Vx Power
      3. 8.3.3 Example Configuration 1
      4. 8.3.4 Example Configuration 2
      5. 8.3.5 Example Configuration 3
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Layout Example
        2. 8.5.1.2 PCB Material
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DP|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.3 Example Configuration 1

In the application example shown in Figure 8-6, ISOUSB211-Q1 is powered using USB VBUS on the connector side, and a local 3.3-V digital supply on the microcontroller side. No other external regulators or power supplies are used.

In this scenario, the total power consumption inside ISOUSB211-Q1 from both sides taken together is:

VBUS1 × IVBUS1 + VBUS1 × IVCC1 + V3P3V2 × I3P3V2 + V3P3V2 × IVCC2

Assuming 5.25 V as the maximum value of VBUS1, and 3.5 V as the maximum value of the 3.3-V local supply, the internal power dissipation is calculated as:

5.25 V×13.5 mA + 5.25 V×96 mA + 3.5 V×13.5 mA+3.5 V×96 mA = 960 mW.

Since the junction-to-air thermal resistance is 44.2°C/W, this power dissipation results in a 42.5°C internal temperature rise. Ambient temperature up to 107°C can be supported for this configuration.

This configuration offers the simplest implementation, but the ambient temperature supported is lower than other configurations.

GUID-20200820-CA0I-Q2ZR-K4LC-M6N2PKNRFNMZ-low.svgFigure 8-6 Using ISOUSB211-Q1 without External 1.8-V Regulators.