SLLSFW6 March 2024 ISOUSB211-Q1
ADVANCE INFORMATION
In the application example shown in Figure 8-8, ISOUSB211-Q1 is powered using USB VBUS on the connector side, and a local 3.3-V digital supply on the microcontroller side to generate V3P3Vx. An external LDO or DC-DC buck converter is used to generate V1P8Vx on both sides.
In this scenario, the total power consumption from both sides taken together is:
VBUS1 × IVBUS1 + V1P8V1 × I1P8V1 + V3P3V2 × I3P3V2 + V1P8V2 × I1P8V2
Assuming 5.25 V as the maximum value of VBUS, and 1.89 V as the maximum value of the external 1.8-V power supply, the internal power dissipation is calculated as
5.25 V×13.5 mA + 1.89 V×96 mA + 3.5 V×13.5 mA+1.89 V×96 mA = 481 mW.
Since the junction-to-air thermal resistance is 44.2°C/W, this power dissipation results in a 22°C internal temperature rise. Ambient temperature up to 128°C can be supported for this configuration.
TLV741P and TLV62568 are examples of low-cost LDO and buck converter respectively that may be used in this application. Both options reduce the power dissipation in ISOUSB211-Q1. However, the buck converter additionally reduces power dissipation at the system level, and also the current drawn from VBUS and local 3.3-V supplies.
This configuation offers the lowest power dissipation and the highest ambient temperature operation using external regulators.