SLLSFW6 March   2024 ISOUSB211-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply Options
      2. 7.3.2  Power Up
      3. 7.3.3  Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 7.3.4  Connect and Speed Detection
      5. 7.3.5  Disconnect Detection
      6. 7.3.6  Reset
      7. 7.3.7  LS/FS Message Traffic
      8. 7.3.8  HS Message Traffic
      9. 7.3.9  Equalization and Pre-emphasis
      10. 7.3.10 L2 Power Management State (Suspend) and Resume
      11. 7.3.11 L1 Power Management State (Sleep) and Resume
      12. 7.3.12 HS Test Mode Support
      13. 7.3.13 CDP Advertising
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Isolated Host or Hub
      2. 8.1.2 Isolated Peripheral - Self-Powered
      3. 8.1.3 Isolated Peripheral - Bus-Powered
      4. 8.1.4 Application Curve
        1. 8.1.4.1 Insulation Lifetime
    2. 8.2 Meeting USB2.0 HS Eye-Diagram Specifications
    3. 8.3 Thermal Considerations
      1. 8.3.1 VBUS / V3P3V Power
      2. 8.3.2 VCCx / V1P8Vx Power
      3. 8.3.3 Example Configuration 1
      4. 8.3.4 Example Configuration 2
      5. 8.3.5 Example Configuration 3
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Layout Example
        2. 8.5.1.2 PCB Material
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DP|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V
V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 V
(1) AEC Q100-002 indicates that HBM stressting shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) Pins UDP, UDM, DDP, and DDM are rated for 1500V HBM