SLLSFG1B February   2020  – December 2020 ISOW7841A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Input, 5-V Output
    10. 7.10 Supply Current Characteristics—5-V Input, 5-V Output
    11. 7.11 Electrical Characteristics—3.3-V Input, 5-V Output
    12. 7.12 Supply Current Characteristics—3.3-V Input, 5-V Output
    13. 7.13 Electrical Characteristics—5-V Input, 3.3-V Output
    14. 7.14 Supply Current Characteristics—5-V Input, 3.3-V Output
    15. 7.15 Electrical Characteristics—3.3-V Input, 3.3-V Output
    16. 7.16 Supply Current Characteristics—3.3-V Input, 3.3-V Output
    17. 7.17 Switching Characteristics—5-V Input, 5-V Output
    18. 7.18 Switching Characteristics—3.3-V Input, 5-V Output
    19. 7.19 Switching Characteristics—5-V Input, 3.3-V Output
    20. 7.20 Switching Characteristics—3.3-V Input, 3.3-V Output
    21. 7.21 Insulation Characteristics Curves
    22. 7.22 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Current Limit, Thermal Overload Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.18 Switching Characteristics—3.3-V Input, 5-V Output

VCC = 3.3 V ±10%, SEL shorted to VISO (over recommended operating conditions, unless otherwise specified)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 8-1 13.5 19.6 ns
PWD Pulse width distortion(1) |tPHL – tPLH| 0.6 4.7 ns
tSK(o) Channel-channel output skew time(2) Same-direction channels 2.5 ns
tSK(p-p) Part-part skew time(3) 4.5 ns
tr, tf Output signal rise and fall times 2 4 ns
(1) Also known as pulse skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.