SWRS211C May   2017  – October 2018 IWR1443

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
    3. 4.3 Pin Multiplexing
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power-On Hours (POH)
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Power Supply Specifications
    6. 5.6 Power Consumption Summary
    7. 5.7 RF Specification
    8. 5.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    9. 5.9 Timing and Switching Characteristics
      1. 5.9.1  Power Supply Sequencing and Reset Timing
      2. 5.9.2  Synchronized Frame Triggering
      3. 5.9.3  Input Clocks and Oscillators
        1. 5.9.3.1 Clock Specifications
      4. 5.9.4  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 5.9.4.1 Peripheral Description
        2. 5.9.4.2 MibSPI Transmit and Receive RAM Organization
          1. Table 5-8  SPI Timing Conditions
          2. Table 5-9  SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. Table 5-10 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 5.9.4.3 SPI Slave Mode I/O Timings
          1. Table 5-11 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 5.9.4.4 Typical Interface Protocol Diagram (Slave Mode)
      5. 5.9.5  LVDS Interface Configuration
        1. 5.9.5.1 LVDS Interface Timings
      6. 5.9.6  General-Purpose Input/Output
        1. Table 5-13 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      7. 5.9.7  Controller Area Network Interface (DCAN)
        1. Table 5-14 Dynamic Characteristics for the DCANx TX and RX Pins
      8. 5.9.8  Serial Communication Interface (SCI)
        1. Table 5-15 SCI Timing Requirements
      9. 5.9.9  Inter-Integrated Circuit Interface (I2C)
        1. Table 5-16 I2C Timing Requirements
      10. 5.9.10 Quad Serial Peripheral Interface (QSPI)
        1. Table 5-17 QSPI Timing Conditions
        2. Table 5-18 Timing Requirements for QSPI Input (Read) Timings
        3. Table 5-19 QSPI Switching Characteristics
      11. 5.9.11 JTAG Interface
        1. Table 5-20 JTAG Timing Conditions
        2. Table 5-21 Timing Requirements for IEEE 1149.1 JTAG
        3. Table 5-22 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
      12. 5.9.12 Camera Serial Interface (CSI)
        1. Table 5-23 CSI Switching Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 External Interfaces
    4. 6.4 Subsystems
      1. 6.4.1 RF and Analog Subsystem
        1. 6.4.1.1 Clock Subsystem
        2. 6.4.1.2 Transmit Subsystem
        3. 6.4.1.3 Receive Subsystem
        4. 6.4.1.4 Radio Processor Subsystem
      2. 6.4.2 Master (Control) System
      3. 6.4.3 Host Interface
    5. 6.5 Accelerators and Coprocessors
    6. 6.6 Other Subsystems
      1. 6.6.1 A2D Data Format Over CSI2 Interface
      2. 6.6.2 ADC Channels (Service) for User Application
        1. Table 6-2 GP-ADC Parameter
    7. 6.7 Identification
    8. 6.8 Boot Modes
      1. 6.8.1 Flashing Mode
      2. 6.8.2 Functional Mode
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 Reference Schematic
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
      3. 7.3.3 Stackup Details
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Export Control Notice
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table 5-19 QSPI Switching Characteristics

NO. PARAMETER MIN TYP MAX UNIT
Q1 tc(SCLK) Cycle time, sclk 25 ns
Q2 tw(SCLKL) Pulse duration, sclk low Y*P – 3(1)(2) ns
Q3 tw(SCLKH) Pulse duration, sclk high Y*P – 3(1) ns
Q4 td(CS-SCLK) Delay time, sclk falling edge to cs active edge –M*P – 1(1)(3) –M*P + 2.5(1)(3) ns
Q5 td(SCLK-CS) Delay time, sclk falling edge to cs inactive edge N*P – 1(1)(3) N*P + 2.5(1)(3) ns
Q6 td(SCLK-D1) Delay time, sclk falling edge to d[1] transition –3.5 7 ns
Q7 tena(CS-D1LZ) Enable time, cs active edge to d[1] driven (lo-z) –P – 4(3) –P +1(3) ns
Q8 tdis(CS-D1Z) Disable time, cs active edge to d[1] tri-stated (hi-z) –P – 4(3) –P +1(3) ns
Q9 td(SCLK-D1) Delay time, sclk first falling edge to first d[1] transition (for PHA = 0 only) –3.5 – P(3) 7 – P(3) ns
Q12 tsu(D-SCLK) Setup time, d[3:0] valid before falling sclk edge 7.3 ns
Q13 th(SCLK-D) Hold time, d[3:0] valid after falling sclk edge 1.5 ns
Q14 tsu(D-SCLK) Setup time, final d[3:0] bit valid before final falling sclk edge 7.3 — P(3) ns
Q15 th(SCLK-D) Hold time, final d[3:0] bit valid after final falling sclk edge 1.5 + P(3) ns
(1) The Y parameter is defined as follows: If DCLK_DIV is 0 or ODD then, Y equals 0.5. If DCLK_DIV is EVEN then, Y equals (DCLK_DIV/2) / (DCLK_DIV+1). For best performance, it is recommended to use a DCLK_DIV of 0 or ODD to minimize the duty cycle distortion. The HSDIVIDER on CLKOUTX2_H13 output of DPLL_PER can be used to achieve the desired clock divider ratio. All required details about clock division factor DCLK_DIV can be found in the device-specific Technical Reference Manual.
(2) P = SCLK period in ns.
(3) M = QSPI_SPI_DC_REG.DDx + 1, N = 2
IWR1443 QSPI_read_mode0.gifFigure 5-15 QSPI Read (Clock Mode 0)
IWR1443 SPRS91v_QSPI_04.gifFigure 5-16 QSPI Write (Clock Mode 0)