SWRS212B May   2017  – April 2018 IWR1642

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-3 PAD IO Register Bit Descriptions
    3. 4.3 Signal Descriptions
      1. Table 4-4 Signal Descriptions - Digital
      2. Table 4-5 Signal Descriptions - Analog
    4. 4.4 Pin Multiplexing
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Supply Specifications
    6. 5.6  Power Consumption Summary
    7. 5.7  RF Specification
    8. 5.8  CPU Specifications
    9. 5.9  Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    10. 5.10 Timing and Switching Characteristics
      1. 5.10.1  Power Supply Sequencing and Reset Timing
      2. 5.10.2  Input Clocks and Oscillators
        1. 5.10.2.1 Clock Specifications
      3. 5.10.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 5.10.3.1 Peripheral Description
        2. 5.10.3.2 MibSPI Transmit and Receive RAM Organization
          1. Table 5-7   SPI Timing Conditions
          2. Table 5-8   SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. Table 5-9   SPI Master Mode Input Timing Requirements (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          4. Table 5-10 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          5. Table 5-11 SPI Master Mode Input Requirements (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 5.10.3.3 SPI Slave Mode I/O Timings
          1. Table 5-12 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
          2. Table 5-13 SPI Slave Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 5.10.3.4 Typical Interface Protocol Diagram (Slave Mode)
      4. 5.10.4  LVDS Interface Configuration
        1. 5.10.4.1 LVDS Interface Timings
      5. 5.10.5  General-Purpose Input/Output
        1. Table 5-15 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      6. 5.10.6  Controller Area Network Interface (DCAN)
        1. Table 5-16 Dynamic Characteristics for the DCANx TX and RX Pins
      7. 5.10.7  Serial Communication Interface (SCI)
        1. Table 5-17 SCI Timing Requirements
      8. 5.10.8  Inter-Integrated Circuit Interface (I2C)
        1. Table 5-18 I2C Timing Requirements
      9. 5.10.9  Quad Serial Peripheral Interface (QSPI)
        1. Table 5-19 QSPI Timing Conditions
        2. Table 5-20 Timing Requirements for QSPI Input (Read) Timings
        3. Table 5-21 QSPI Switching Characteristics
      10. 5.10.10 ETM Trace Interface
        1. Table 5-22 ETMTRACE Timing Conditions
        2. Table 5-23 ETM TRACE Switching Characteristics
      11. 5.10.11 Data Modification Module (DMM)
        1. Table 5-24 DMM Timing Requirements
      12. 5.10.12 JTAG Interface
        1. Table 5-25 JTAG Timing Conditions
        2. Table 5-26 Timing Requirements for IEEE 1149.1 JTAG
        3. Table 5-27 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Subsystems
      1. 6.3.1 RF and Analog Subsystem
        1. 6.3.1.1 Clock Subsystem
        2. 6.3.1.2 Transmit Subsystem
        3. 6.3.1.3 Receive Subsystem
      2. 6.3.2 Processor Subsystem
      3. 6.3.3 Host Interface
      4. 6.3.4 Master Subsystem Cortex-R4F Memory Map
      5. 6.3.5 DSP Subsystem Memory Map
    4. 6.4 Other Subsystems
      1. 6.4.1 ADC Channels (Service) for User Application
        1. Table 6-3 GP-ADC Parameter
  7. 7 Monitoring and Diagnostics
    1. 7.1 Monitoring and Diagnostic Mechanisms
      1. 7.1.1 Error Signaling Module
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Reference Schematic
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
      3. 8.3.3 Stackup Details
  9. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Community Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Export Control Notice
    8. 9.8 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
      1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1.3 Description

The IWR1642 device is an integrated single-chip mmWave sensor based on FMCW radar technology capable of operation in the 76- to 81-GHz band with up to 4 GHz continuous chirp. The device is built with TI’s low-power 45-nm RFCMOS process, and this solution enables unprecedented levels of integration in an extremely small form factor. The IWR1642 is an ideal solution for low-power, self-monitored, ultra-accurate radar systems in industrial applications such as building automation, factory automation, drones, material handling, traffic monitoring, and surveillance.

The IWR1642 device is a self-contained, single-chip solution that simplifies the implementation of mmWave sensors in the band of 76 to 81 GHz. IWR1642 includes a monolithic implementation of a 2TX, 4RX system with built-in PLL and A2D converters. The IWR1642 also integrates a DSP subsystem, which contains TI's high-performance C674x DSP for the radar signal processing. The device includes an ARM R4F-based processor subsystem, which is responsible for front-end configuration, control, and calibration. Simple programming model changes can enable a wide variety of sensor implementation with the possibility of dynamic reconfiguration for implementing a multimode sensor. Additionally, the device is provided as a complete platform solution including reference hardware design, software drivers, sample configurations, API guide, training, and user documentation.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE
IWR1642AQAGABL (Tray) FCBGA (161) 10.4 mm × 10.4 mm
IWR1642AQAGABLR (Tape & Reel)
(1) For more information, see Section 10, Mechanical Packaging and Orderable Information.