SWRS212B May   2017  – April 2018 IWR1642

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-3 PAD IO Register Bit Descriptions
    3. 4.3 Signal Descriptions
      1. Table 4-4 Signal Descriptions - Digital
      2. Table 4-5 Signal Descriptions - Analog
    4. 4.4 Pin Multiplexing
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Supply Specifications
    6. 5.6  Power Consumption Summary
    7. 5.7  RF Specification
    8. 5.8  CPU Specifications
    9. 5.9  Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    10. 5.10 Timing and Switching Characteristics
      1. 5.10.1  Power Supply Sequencing and Reset Timing
      2. 5.10.2  Input Clocks and Oscillators
        1. 5.10.2.1 Clock Specifications
      3. 5.10.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 5.10.3.1 Peripheral Description
        2. 5.10.3.2 MibSPI Transmit and Receive RAM Organization
          1. Table 5-7   SPI Timing Conditions
          2. Table 5-8   SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. Table 5-9   SPI Master Mode Input Timing Requirements (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          4. Table 5-10 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          5. Table 5-11 SPI Master Mode Input Requirements (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 5.10.3.3 SPI Slave Mode I/O Timings
          1. Table 5-12 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
          2. Table 5-13 SPI Slave Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 5.10.3.4 Typical Interface Protocol Diagram (Slave Mode)
      4. 5.10.4  LVDS Interface Configuration
        1. 5.10.4.1 LVDS Interface Timings
      5. 5.10.5  General-Purpose Input/Output
        1. Table 5-15 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      6. 5.10.6  Controller Area Network Interface (DCAN)
        1. Table 5-16 Dynamic Characteristics for the DCANx TX and RX Pins
      7. 5.10.7  Serial Communication Interface (SCI)
        1. Table 5-17 SCI Timing Requirements
      8. 5.10.8  Inter-Integrated Circuit Interface (I2C)
        1. Table 5-18 I2C Timing Requirements
      9. 5.10.9  Quad Serial Peripheral Interface (QSPI)
        1. Table 5-19 QSPI Timing Conditions
        2. Table 5-20 Timing Requirements for QSPI Input (Read) Timings
        3. Table 5-21 QSPI Switching Characteristics
      10. 5.10.10 ETM Trace Interface
        1. Table 5-22 ETMTRACE Timing Conditions
        2. Table 5-23 ETM TRACE Switching Characteristics
      11. 5.10.11 Data Modification Module (DMM)
        1. Table 5-24 DMM Timing Requirements
      12. 5.10.12 JTAG Interface
        1. Table 5-25 JTAG Timing Conditions
        2. Table 5-26 Timing Requirements for IEEE 1149.1 JTAG
        3. Table 5-27 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Subsystems
      1. 6.3.1 RF and Analog Subsystem
        1. 6.3.1.1 Clock Subsystem
        2. 6.3.1.2 Transmit Subsystem
        3. 6.3.1.3 Receive Subsystem
      2. 6.3.2 Processor Subsystem
      3. 6.3.3 Host Interface
      4. 6.3.4 Master Subsystem Cortex-R4F Memory Map
      5. 6.3.5 DSP Subsystem Memory Map
    4. 6.4 Other Subsystems
      1. 6.4.1 ADC Channels (Service) for User Application
        1. Table 6-3 GP-ADC Parameter
  7. 7 Monitoring and Diagnostics
    1. 7.1 Monitoring and Diagnostic Mechanisms
      1. 7.1.1 Error Signaling Module
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Reference Schematic
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
      3. 8.3.3 Stackup Details
  9. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Community Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Export Control Notice
    8. 9.8 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
      1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Revision History

Changes from August 31, 2017 to April 30, 2018 (from A Revision () to B Revision)

  • Updated/Changed TX Power from "12 dBm" to "12.5 dBm"Go
  • Updated/Changed RX Noise Figure from "15 dB (76 to 77 GHz)" to "14 dB (76 to 77 GHz)"Go
  • Updated/Changed RX Noise Figure from "16 dB (77 to 81 GHz)" to "15 dB (77 to 81 GHz)"Go
  • Updated/Changed Phase Noise at 1 MHz from " –93 dBc/Hz (76 to 77 GHz)" to " –95 dBc/Hz (76 to 77 GHz)"Go
  • Updated/Changed Phase Noise at 1 MHz from "–91 dBc/Hz (77 to 81 GHz)" to "–93 dBc/Hz (77 to 81 GHz)"Go
  • Updated/Changed Features from "...Object Detection and Interface Control" to "...Object Tracking, Classification, and Interface Control"Go
  • Updated/Changed Features from "Supports Crystal Connection..." to "Supports 40 MHz Crystal Connection..."Go
  • Added "People Counting" and "Motion Detection" to ApplicationsGo
  • Updated/Changed caption from "Autonomous Radar Sensor..." to "Automotive Sensor..."Go
  • Added Tray PART NUMBER to Device InformationGo
  • Updated/Changed Device Information from "XI1642QGABL (Reel)" to "IWR1642AQAGABLR (Reel)"Go
  • Updated RX and TX connections in Functional Block DiagramGo
  • Added RF Control/BIST block to Functional Block DiagramGo
  • Removed "Cascade (20-GHz sync)" from Device Features ComparisonGo
  • Updated/Changed pin B15 to GPIO_41 in Pin DiagramGo
  • Corrected A10 pin to "VOUT_14APLL"Go
  • Updated/Changed pin N14 from "RESERVED" to "DMM_SYNC" in Pin DiagramGo
  • Updated/Changed Pin Attributes (ABL0161 Package) to match the AWR1642 deviceGo
  • Updated/Changed all instances of "CAN_FD_tx" to "Reserved" in Pin Attributes (ABL0161 Package)Go
  • Updated/Changed all instances of "CAN_FD_rx" to "Reserved" in Pin Attributes (ABL0161 Package)Go
  • Added two register tables after Pin AttributesGo
  • Updated/Changed PAD IO Control RegistersGo
  • Cleaned up CLKP and CLKM signals in Signal Descriptions - AnalogGo
  • Removed R14 from Power supply VIOINGo
  • Added pin R15 to Power supply VSSGo
  • Removed duplicate Pin Multiplexing tableGo
  • Updated/Changed all CAN_FD to ReservedGo
  • Cleaned up VIN_13RF1 and VIN_13F2 in Absolute Maximum RatingsGo
  • Updated/Changed CLKP, CLKM row in Absolute Maximum ratings from "Input ports for reference crystal" to "Input ports for reference crystal, or external oscillator input"Go
  • Added table note to ESD RatingsGo
  • Updated/Changed Power-On Hours (POH)Go
  • Added VIN_18VCO row to Recommended Operating ConditionsGo
  • Updated/Changed VIL in Recommended Operating ConditionsGo
  • Updated/Changed VOH MIN from "85% VIOIN" to "VIOIN – 450"Go
  • Updated/Changed VOL MAX from "350" to "450"Go
  • Added NRESET row to Recommended Operating ConditionsGo
  • Updated/Changed Ripple Specifications FREQUENCY from "4200" to "4400"Go
  • Updated Average Power Consumption at Power TerminalsGo
  • Updated/Changed RF Specification to match AWR16Go
  • Updated/Changed IMRR TYP from 40 dB to 21 dBGo
  • Updated/Changed Power Supply Sequencing and Reset Timing imageGo
  • Updated/Changed Clock Specifications text from "(that is, a 40-MHz crystal) " to "(that is, a 40-MHz crystal or external oscillator to CLKP) "Go
  • Updated/Changed Crystal Implementation image from "40 and 50 MHz" to "40 MHz"Go
  • Updated/Changed fP Parallel resonance crystal frequency from " 40, 50" to "40"Go
  • Added External Clock Mode SpecificationsGo
  • Removed External Clock Electrical Characteristics tableGo
  • Updated/Changed External Clock Mode Specifications table to match AWR16Go
  • Updated SPI Slave Mode Switching ParametersGo
  • Updated SPI Slave Mode Timing RequirementsGo
  • Updated/Changed all MIN values in Timing Requirements for QSPI Input (Read) TimingsGo
  • Added "People Counting" and "Gesturing" to Detailed Description OverviewGo
  • Updated/Changed Clock Subsystem diagramGo
  • Updated/Changed Host Interrupt bullet in Host InterfaceGo
  • Removed Security Modules from Master Subsystem, Cortex-R4F Memory MapGo
  • Removed "...and ENOB of ~9 bits" from ADC Channels (Service) for User ApplicationGo
  • Updated/Changed text from "ADC channel mapped to B12" to "GPADC channel 6"Go
  • Updated/Changed GP-ADC Parameter table to match AWR16Go
  • Updated/Changed Monitoring and Diagnostic MechanismsGo
  • Added "People counting", "Gesturing", and "Motion detection" to Application InformationGo
  • Updated/Changed the Device Nomenclature imageGo