SWRS289
october 2021
IWR2243
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Revision History
6
Device Comparison
6.1
Related Products
7
Terminal Configuration and Functions
7.1
Pin Diagram
7.2
Signal Descriptions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Power-On Hours (POH)
8.4
Recommended Operating Conditions
8.5
Power Supply Specifications
8.6
Power Consumption Summary
8.7
RF Specification
8.8
Thermal Resistance Characteristics for FCBGA Package [ABL0161]
8.9
Timing and Switching Characteristics
8.9.1
Power Supply Sequencing and Reset Timing
8.9.2
Synchronized Frame Triggering
8.9.3
Input Clocks and Oscillators
8.9.3.1
Clock Specifications
8.9.4
Multibuffered / Standard Serial Peripheral Interface (MibSPI)
8.9.4.1
Peripheral Description
8.9.4.1.1
SPI Timing Conditions
8.9.4.1.2
SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
8.9.4.1.3
SPI Peripheral Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
8.9.4.2
Typical Interface Protocol Diagram (Peripheral Mode)
8.9.5
Inter-Integrated Circuit Interface (I2C)
8.9.5.1
I2C Timing Requirements
8.9.6
Quad Serial Peripheral Interface (QSPI)
8.9.6.1
QSPI Timing Conditions
8.9.6.2
Timing Requirements for QSPI Input (Read) Timings
8.9.6.3
QSPI Switching Characteristics
8.9.7
LVDS Interface Configuration
8.9.7.1
LVDS Interface Timings
8.9.8
General-Purpose Input/Output
8.9.8.1
Switching Characteristics for Output Timing versus Load Capacitance (CL)
8.9.9
Camera Serial Interface (CSI)
8.9.9.1
CSI Switching Characteristics
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Subsystems
9.3.1
RF and Analog Subsystem
9.3.1.1
Clock Subsystem
9.3.1.2
Transmit Subsystem
9.3.1.3
Receive Subsystem
9.3.2
Host Interface
9.4
Other Subsystems
9.4.1
ADC Data Format Over CSI2 Interface
9.4.2
ADC Channels (Service) for User Application
9.4.2.1
GPADC Parameters
10
Monitoring and Diagnostic Mechanisms
11
Applications, Implementation, and Layout
11.1
Application Information
11.2
Imaging Radar using Cascade Configuration
11.3
Reference Schematic
11.4
Layout
11.4.1
Layout Guidelines
11.4.2
Stackup Details
12
Device and Documentation Support
12.1
Device Nomenclature
12.2
Tools and Software
12.3
Documentation Support
12.4
Support Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Export Control Notice
12.8
Glossary
13
Mechanical, Packaging, and Orderable Information
13.1
Packaging Information
Package Options
Mechanical Data (Package|Pins)
ABL|161
MPBGAL4B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
swrs289_oa
swrs289_pm
1
Features
FMCW transceiver
Integrated PLL, transmitter, receiver, baseband, and ADC
76- to 81-GHz coverage with 5 GHz available bandwidth
Four receive channels
Three transmit channels
Ultra-accurate chirp engine based on Fractional-N PLL
TX power: 13 dBm
RX noise figure: 13 dB
Phase noise at 1 MHz:
–96 dBc/Hz (76 to 77 GHz)
–94 dBc/Hz (77 to 81 GHz)
Built-in calibration and self-test
Built-in firmware (ROM)
Self-calibrating system across frequency and temperature
Host interface
Control interface with external processor over SPI or I2C interface
Data interface with external processor over MIPI D-PHY and CSI2 v1.1
Interrupts for Fault Reporting
Functional Safety-Compliant
Developed for functional safety applications
Documentation available to aid IEC 61508 functional safety system design up to SIL 3
Hardware integrity up to SIL-2
Safety-related certification
IEC 61508 certified upto SIL 2 by TUV SUD
IWR2243 advanced features
Embedded self-monitoring with limited Host processor involvement
Complex baseband architecture
Option of cascading multiple devices to increase channel count
Embedded interference detection capability
Power management
Built-in LDO Network for enhanced PSRR
I/Os support dual voltage 3.3 V/1.8 V
Clock source
Supports externally driven clock (square/sine) at 40 MHz
Supports 40 MHz crystal connection with load capacitors
Easy hardware design
0.65-mm pitch, 161-pin 10.4 mm × 10.4 mm flip chip BGA package for easy assembly and low-cost PCB design
Small solution size
Junction temperature range of –40°C to 105°C
Figure 1-1
Radar Sensor for Industrial Applications