SWRS330 May   2024 IWR2944

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configurations and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions - Digital
    4. 5.4 Signal Descriptions - Analog
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.5.2 Hardware Requirements
      3. 6.5.3 Impact to Your Hardware Warranty
    6. 6.6  Power Supply Specifications
    7. 6.7  Power Consumption Summary
    8. 6.8  RF Specifications
    9. 6.9  Thermal Resistance Characteristics
    10. 6.10 Power Supply Sequencing and Reset Timing
    11. 6.11 Input Clocks and Oscillators
      1. 6.11.1 Clock Specifications
    12. 6.12 Peripheral Information
      1. 6.12.1  QSPI Flash Memory Peripheral
        1. 6.12.1.1 QSPI Timing Conditions
        2. 6.12.1.2 QSPI Timing Requirements #GUID-CD30070D-F132-4A2C-92CD-5AA96AE70B94/GUID-97D19708-D87E-443B-9ADF-1760CFEF6F4C #GUID-CD30070D-F132-4A2C-92CD-5AA96AE70B94/GUID-0A61EEC9-2B95-4C27-B219-18D27C8F9430
        3. 6.12.1.3 QSPI Switching Characteristics #GUID-20B35D26-AFE6-451C-B9E9-B3F2FA08097C/T4362547-64 #GUID-20B35D26-AFE6-451C-B9E9-B3F2FA08097C/T4362547-65
      2. 6.12.2  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 6.12.2.1 MibSPI Peripheral Description
        2. 6.12.2.2 MibSPI Transmit and Receive RAM Organization
          1. 6.12.2.2.1 SPI Timing Conditions
          2. 6.12.2.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-20BA2ACF-4FC2-43F6-960F-1A4CA56E65A6/T4362547-236 #GUID-20BA2ACF-4FC2-43F6-960F-1A4CA56E65A6/T4362547-237 #GUID-20BA2ACF-4FC2-43F6-960F-1A4CA56E65A6/T4362547-238
          3. 6.12.2.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-517E5284-3345-461F-B07F-EB95741B1272/T4362547-244 #GUID-517E5284-3345-461F-B07F-EB95741B1272/T4362547-245 #GUID-517E5284-3345-461F-B07F-EB95741B1272/T4362547-246
        3. 6.12.2.3 SPI Peripheral Mode I/O Timings
          1. 6.12.2.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) #GUID-5C88F9F6-787B-49E2-984F-02158AB0C326/T4362547-70 #GUID-5C88F9F6-787B-49E2-984F-02158AB0C326/T4362547-71 #GUID-5C88F9F6-787B-49E2-984F-02158AB0C326/T4362547-73
      3. 6.12.3  Ethernet Switch (RGMII/RMII/MII) Peripheral
        1. 6.12.3.1  RGMII/MII Timing Conditions
        2. 6.12.3.2  RGMII Transmit Clock Switching Characteristics
        3. 6.12.3.3  RGMII Transmit Data and Control Switching Characteristics
        4. 6.12.3.4  RGMII Receive Clock Timing Requirements
        5. 6.12.3.5  RGMII Receive Data and Control Timing Requirements
        6. 6.12.3.6  RMII Transmit Clock Switching Characteristics
        7. 6.12.3.7  RMII Transmit Data and Control Switching Characteristics
        8. 6.12.3.8  RMII Receive Clock Timing Requirements
        9. 6.12.3.9  RMII Receive Data and Control Timing Requirements
        10. 6.12.3.10 MII Transmit Switching Characteristics
        11. 6.12.3.11 MII Receive Clock Timing Requirements
        12. 6.12.3.12 MII Receive Timing Requirements
        13. 6.12.3.13 MII Transmit Clock Timing Requirements
        14. 6.12.3.14 MDIO Interface Timings
      4. 6.12.4  LVDS/Aurora Instrumentation and Measurement Peripheral
        1. 6.12.4.1 LVDS Interface Configuration
        2. 6.12.4.2 LVDS Interface Timings
      5. 6.12.5  UART Peripheral
        1. 6.12.5.1 SCI Timing Requirements
      6. 6.12.6  Inter-Integrated Circuit Interface (I2C)
        1. 6.12.6.1 I2C Timing Requirements #GUID-437677C7-D935-4733-A64D-553EFECA73F7/T4362547-185
      7. 6.12.7  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 6.12.7.1 Dynamic Characteristics for the CAN-FD TX and RX Pins
      8. 6.12.8  CSI2 Receiver Peripheral
        1. 6.12.8.1 CSI2 Switching Characteristics
      9. 6.12.9  Enhanced Pulse-Width Modulator (ePWM)
      10. 6.12.10 General-Purpose Input/Output
        1. 6.12.10.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-46919170-3C9C-440C-879B-A7700B77517D/T4362547-45 #GUID-46919170-3C9C-440C-879B-A7700B77517D/T4362547-50
    13. 6.13 Emulation and Debug
      1. 6.13.1 Emulation and Debug Description
      2. 6.13.2 JTAG Interface
        1. 6.13.2.1 Timing Requirements for IEEE 1149.1 JTAG
        2. 6.13.2.2 Switching Characteristics for IEEE 1149.1 JTAG
      3. 6.13.3 ETM Trace Interface
        1. 6.13.3.1 ETM TRACE Timing Requirements
        2. 6.13.3.2 ETM TRACE Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Subsystems
      1. 7.3.1 RF and Analog Subsystem
        1. 7.3.1.1 RF Clock Subsystem
        2. 7.3.1.2 Transmit Subsystem
        3. 7.3.1.3 Receive Subsystem
      2. 7.3.2 Processor Subsystem
    4. 7.4 Other Subsystems
      1. 7.4.1 Hardware Accelerator Subsystem
      2. 7.4.2 Security – Hardware Security Module
      3. 7.4.3 ADC Channels (Service) for User Application
  9. 8 Monitoring and Diagnostics
    1. 8.1 Monitoring and Diagnostic Mechanisms
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Short and Medium Range Radar
    3. 9.3 Reference Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • FMCW transceiver
    • Integrated PLL, transmitter, receiver, baseband and ADC
    • 76 to 81GHz coverage with over 4.5GHz continuous bandwidth
    • 4 receive and 4 transmit channels for PCB interface to antennas
    • Per transmit phase shifter
    • Ultra-accurate chirp engine based on fractional-N PLL
    • TX power
      • 13.5dBm
    • RX noise figure
      • 12dBm
    • Phase noise at 1MHz
      • -96dBc/Hz (76 to 77GHz)
      • -95dBc/Hz (76 to 81GHz)

  • Built-in calibration and self-test

    • Built in firmware (ROM)
    • Self-calibrating system across process and temperature
  • Processing elements
    • Arm® Cortex-R5F® core (supports lock step operation) @300MHz
    • TI digital signal processor C66x @360MHz
    • TI radar hardware accelerator (HWA2.1) for operations like FFT, log magnitude, and memory compression
    • Multiple EDMA instances for data movement
  • Host interface
    • 2x CAN-FD
    • 10/100Mbps RGMII/RMII/MII Ethernet
  • Supports a serial flash memory interface (loading user application from QSPI flash memory)
  • Other interfaces available to user application
    • Up to 9 ADC channels
    • 2 SPIs
    • 4 UARTs
    • I2C
    • GPIOs
    • 3 EPWMs
    • 4-lane Aurora LVDS interface for raw ADC data and debug instrumentation
    • CSI2 Rx interface to enable playback of the captured data
  • On-Chip RAM
    • 4MBytes of ‘On Chip’ RAM
    • Memory space split between DSP, MCU, and shared L3
  • Device security (on select part numbers)
    • Programmable embedded hardware security module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), asymmetric keys (up to RSA-4K or ECC-512) with key revocation capability
    • Cryptographic hardware accelerators: PKA with ECC, AES (up to 256 bit), SHA (up to 512 bit), TRNG/DRBG
  • Functional safety compliant targeted
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Hardware integrity up to SIL-2 targeted
  • Advanced features
    • Embedded self-monitoring with no external processor involvement
    • Embedded interference detection capability
  • Power management
    • On-die LDO network for enhanced PSRR
    • LVCMOS IO supports dual voltage 3.3V and 1.8V
  • Clock source
    • 40MHz crystal with internal oscillator
    • Supports external oscillator at 40MHz
    • Supports externally driven clock (square or sine wave) at 40MHz
  • Effective Power Management
    • Recommended LP87745 Power Management ICs (PMIC)
      • Companion PMIC specially designed to meet device power supply requirements
      • Flexible mapping and factory programmed configurations to support different use cases
  • Cost-reduced hardware design
    • 0.65mm pitch, 12mm × 12mm flip chip BGA package for easy assembly and low-cost PCB design
    • Small solution size
  • Supports wide temperature operating range
    • Operating junction temperature range: –40°C to 125°C