SWRS330 May   2024 IWR2944

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configurations and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions - Digital
    4. 5.4 Signal Descriptions - Analog
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.5.2 Hardware Requirements
      3. 6.5.3 Impact to Your Hardware Warranty
    6. 6.6  Power Supply Specifications
    7. 6.7  Power Consumption Summary
    8. 6.8  RF Specifications
    9. 6.9  Thermal Resistance Characteristics
    10. 6.10 Power Supply Sequencing and Reset Timing
    11. 6.11 Input Clocks and Oscillators
      1. 6.11.1 Clock Specifications
    12. 6.12 Peripheral Information
      1. 6.12.1  QSPI Flash Memory Peripheral
        1. 6.12.1.1 QSPI Timing Conditions
        2. 6.12.1.2 QSPI Timing Requirements #GUID-CD30070D-F132-4A2C-92CD-5AA96AE70B94/GUID-97D19708-D87E-443B-9ADF-1760CFEF6F4C #GUID-CD30070D-F132-4A2C-92CD-5AA96AE70B94/GUID-0A61EEC9-2B95-4C27-B219-18D27C8F9430
        3. 6.12.1.3 QSPI Switching Characteristics #GUID-20B35D26-AFE6-451C-B9E9-B3F2FA08097C/T4362547-64 #GUID-20B35D26-AFE6-451C-B9E9-B3F2FA08097C/T4362547-65
      2. 6.12.2  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 6.12.2.1 MibSPI Peripheral Description
        2. 6.12.2.2 MibSPI Transmit and Receive RAM Organization
          1. 6.12.2.2.1 SPI Timing Conditions
          2. 6.12.2.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-20BA2ACF-4FC2-43F6-960F-1A4CA56E65A6/T4362547-236 #GUID-20BA2ACF-4FC2-43F6-960F-1A4CA56E65A6/T4362547-237 #GUID-20BA2ACF-4FC2-43F6-960F-1A4CA56E65A6/T4362547-238
          3. 6.12.2.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-517E5284-3345-461F-B07F-EB95741B1272/T4362547-244 #GUID-517E5284-3345-461F-B07F-EB95741B1272/T4362547-245 #GUID-517E5284-3345-461F-B07F-EB95741B1272/T4362547-246
        3. 6.12.2.3 SPI Peripheral Mode I/O Timings
          1. 6.12.2.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) #GUID-5C88F9F6-787B-49E2-984F-02158AB0C326/T4362547-70 #GUID-5C88F9F6-787B-49E2-984F-02158AB0C326/T4362547-71 #GUID-5C88F9F6-787B-49E2-984F-02158AB0C326/T4362547-73
      3. 6.12.3  Ethernet Switch (RGMII/RMII/MII) Peripheral
        1. 6.12.3.1  RGMII/MII Timing Conditions
        2. 6.12.3.2  RGMII Transmit Clock Switching Characteristics
        3. 6.12.3.3  RGMII Transmit Data and Control Switching Characteristics
        4. 6.12.3.4  RGMII Receive Clock Timing Requirements
        5. 6.12.3.5  RGMII Receive Data and Control Timing Requirements
        6. 6.12.3.6  RMII Transmit Clock Switching Characteristics
        7. 6.12.3.7  RMII Transmit Data and Control Switching Characteristics
        8. 6.12.3.8  RMII Receive Clock Timing Requirements
        9. 6.12.3.9  RMII Receive Data and Control Timing Requirements
        10. 6.12.3.10 MII Transmit Switching Characteristics
        11. 6.12.3.11 MII Receive Clock Timing Requirements
        12. 6.12.3.12 MII Receive Timing Requirements
        13. 6.12.3.13 MII Transmit Clock Timing Requirements
        14. 6.12.3.14 MDIO Interface Timings
      4. 6.12.4  LVDS/Aurora Instrumentation and Measurement Peripheral
        1. 6.12.4.1 LVDS Interface Configuration
        2. 6.12.4.2 LVDS Interface Timings
      5. 6.12.5  UART Peripheral
        1. 6.12.5.1 SCI Timing Requirements
      6. 6.12.6  Inter-Integrated Circuit Interface (I2C)
        1. 6.12.6.1 I2C Timing Requirements #GUID-437677C7-D935-4733-A64D-553EFECA73F7/T4362547-185
      7. 6.12.7  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 6.12.7.1 Dynamic Characteristics for the CAN-FD TX and RX Pins
      8. 6.12.8  CSI2 Receiver Peripheral
        1. 6.12.8.1 CSI2 Switching Characteristics
      9. 6.12.9  Enhanced Pulse-Width Modulator (ePWM)
      10. 6.12.10 General-Purpose Input/Output
        1. 6.12.10.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-46919170-3C9C-440C-879B-A7700B77517D/T4362547-45 #GUID-46919170-3C9C-440C-879B-A7700B77517D/T4362547-50
    13. 6.13 Emulation and Debug
      1. 6.13.1 Emulation and Debug Description
      2. 6.13.2 JTAG Interface
        1. 6.13.2.1 Timing Requirements for IEEE 1149.1 JTAG
        2. 6.13.2.2 Switching Characteristics for IEEE 1149.1 JTAG
      3. 6.13.3 ETM Trace Interface
        1. 6.13.3.1 ETM TRACE Timing Requirements
        2. 6.13.3.2 ETM TRACE Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Subsystems
      1. 7.3.1 RF and Analog Subsystem
        1. 7.3.1.1 RF Clock Subsystem
        2. 7.3.1.2 Transmit Subsystem
        3. 7.3.1.3 Receive Subsystem
      2. 7.3.2 Processor Subsystem
    4. 7.4 Other Subsystems
      1. 7.4.1 Hardware Accelerator Subsystem
      2. 7.4.2 Security – Hardware Security Module
      3. 7.4.3 ADC Channels (Service) for User Application
  9. 8 Monitoring and Diagnostics
    1. 8.1 Monitoring and Diagnostic Mechanisms
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Short and Medium Range Radar
    3. 9.3 Reference Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM) per ANSI/ESDA/JEDEC JS-001 (1) All pins ±2000 V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002 (2) All pins ±500
Corner pins
 ±750
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process