SWRS219E October   2018  – June 2021 IWR6443 , IWR6843

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
      1. 7.2.1 Signal Descriptions - Digital
      2. 7.2.2 Signal Descriptions - Analog
    3. 7.3 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Supply Specifications
    6. 8.6  Power Consumption Summary
    7. 8.7  RF Specification
    8. 8.8  CPU Specifications
    9. 8.9  Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1  Power Supply Sequencing and Reset Timing
      2. 8.10.2  Input Clocks and Oscillators
        1. 8.10.2.1 Clock Specifications
      3. 8.10.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.10.3.1 Peripheral Description
        2. 8.10.3.2 MibSPI Transmit and Receive RAM Organization
          1. 8.10.3.2.1 SPI Timing Conditions
          2. 8.10.3.2.2 SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
          3. 8.10.3.2.3 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
        3. 8.10.3.3 SPI Slave Mode I/O Timings
          1. 8.10.3.3.1 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
        4. 8.10.3.4 Typical Interface Protocol Diagram (Slave Mode)
      4. 8.10.4  LVDS Interface Configuration
        1. 8.10.4.1 LVDS Interface Timings
      5. 8.10.5  General-Purpose Input/Output
        1. 8.10.5.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) (1) (1)
      6. 8.10.6  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 8.10.6.1 Dynamic Characteristics for the CANx TX and RX Pins
      7. 8.10.7  Serial Communication Interface (SCI)
        1. 8.10.7.1 SCI Timing Requirements
      8. 8.10.8  Inter-Integrated Circuit Interface (I2C)
        1. 8.10.8.1 I2C Timing Requirements (1)
      9. 8.10.9  Quad Serial Peripheral Interface (QSPI)
        1. 8.10.9.1 QSPI Timing Conditions
        2. 8.10.9.2 Timing Requirements for QSPI Input (Read) Timings (1) (1)
        3. 8.10.9.3 QSPI Switching Characteristics
      10. 8.10.10 ETM Trace Interface
        1. 8.10.10.1 ETMTRACE Timing Conditions
        2. 8.10.10.2 ETM TRACE Switching Characteristics
      11. 8.10.11 Data Modification Module (DMM)
        1. 8.10.11.1 DMM Timing Requirements
      12. 8.10.12 JTAG Interface
        1. 8.10.12.1 JTAG Timing Conditions
        2. 8.10.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 8.10.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Processor Subsystem
      3. 9.3.3 Host Interface
      4. 9.3.4 Main Subsystem Cortex-R4F
      5. 9.3.5 DSP Subsystem
      6. 9.3.6 Hardware Accelerator
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Channels (Service) for User Application
        1. 9.4.1.1 GP-ADC Parameter
  10. 10Monitoring and Diagnostics
    1. 10.1 Monitoring and Diagnostic Mechanisms
      1. 10.1.1 Error Signaling Module
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Reference Schematic
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2. 13.2 Tray Information for ABL, 10.4 × 10.4 mm

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
  • ALA|209
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.10.3.3.1 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input,
and SPISOMI = output)(1)(2)(3)
NO.PARAMETERMINTYPMAXUNIT
1tc(SPC)SCycle time, SPICLK(4)25ns
2(5)tw(SPCH)SPulse duration, SPICLK high (clock polarity = 0)10ns
tw(SPCL)SPulse duration, SPICLK low (clock polarity = 1)10
3(5)tw(SPCL)SPulse duration, SPICLK low (clock polarity = 0)10ns
tw(SPCH)SPulse duration, SPICLK high (clock polarity = 1)10
4(5)td(SPCH-SOMI)SDelay time, SPISOMI valid after SPICLK high (clock polarity = 0)10ns
td(SPCL-SOMI)SDelay time, SPISOMI valid after SPICLK low (clock polarity = 1)10
5(5)th(SPCH-SOMI)SHold time, SPISOMI data valid after SPICLK high (clock polarity = 0)2ns
th(SPCL-SOMI)SHold time, SPISOMI data valid after SPICLK low (clock polarity = 1)2
4(5)td(SPCH-SOMI)SDelay time, SPISOMI valid after SPICLK high (clock polarity = 0; clock phase = 0) OR (clock polarity = 1; clock phase = 1)10ns
td(SPCL-SOMI)SDelay time, SPISOMI valid after SPICLK low (clock polarity = 1; clock phase = 0) OR (clock polarity = 0; clock phase = 1)10
5(5)th(SPCH-SOMI)SHold time, SPISOMI data valid after SPICLK high (clock polarity = 0; clock phase = 0) OR (clock polarity = 1; clock phase = 1)2ns
th(SPCL-SOMI)SHold time, SPISOMI data valid after SPICLK low (clock polarity = 1; clock phase = 0) OR (clock polarity = 0; clock phase = 1)2
6(5)tsu(SIMO-SPCL)SSetup time, SPISIMO before SPICLK low (clock polarity = 0; clock phase = 0) OR (clock polarity = 1; clock phase = 1)3ns
tsu(SIMO-SPCH)SSetup time, SPISIMO before SPICLK high (clock polarity = 1; clock phase = 0) OR (clock polarity = 0; clock phase = 1)3
7(5)th(SPCL-SIMO)SHold time, SPISIMO data valid after SPICLK low (clock polarity = 0; clock phase = 0) OR (clock polarity = 1; clock phase = 1)1ns
th(SPCL-SIMO)SHold time, SPISIMO data valid after SPICLK high (clock polarity = 1; clock phase = 0) OR (clock polarity = 0; clock phase = 1)1
(1) The MASTER bit (SPIGCRx.0) is cleared ( where x = 0 or 1 ).
(2) The CLOCK PHASE bit (SPIFMTx.16) is either cleared or set for CLOCK PHASE = 0 or CLOCK PHASE = 1 respectively.
(3) tc(MSS_VCLK) = main subsystem clock time = 1 / f(MSS_VCLK). For more details, see the Technical Reference Manual.
(4) When the SPI is in Slave mode, the following must be true: For PS values from 1 to 255: tc(SPC)S ≥ (PS +1)tc(MSS_VCLK) ≥ 25 ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.For PS values of 0: tc(SPC)S = 2tc(MSS_VCLK) ≥ 25 ns.
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
GUID-F496D16D-8922-4068-9FB3-E7421CA62864-low.gifFigure 8-8 SPI Slave Mode External Timing (CLOCK PHASE = 0)
GUID-7473C58F-0953-4CE7-A253-7A234A4F760C-low.gifFigure 8-9 SPI Slave Mode External Timing (CLOCK PHASE = 1)