SWRS237B April   2020  – July 2022 IWR6843AOP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
      1. 7.2.1 Pin Functions - Digital and Analog [ALP Package]
    3. 7.3 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Supply Specifications
    6. 8.6  Power Consumption Summary
    7. 8.7  RF Specification
    8. 8.8  CPU Specifications
    9. 8.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1  Antenna Radiation Patterns
        1. 8.10.1.1 Antenna Radiation Patterns for Receiver
        2. 8.10.1.2 Antenna Radiation Patterns for Transmitter
      2. 8.10.2  Antenna Positions
      3. 8.10.3  Power Supply Sequencing and Reset Timing
      4. 8.10.4  Input Clocks and Oscillators
        1. 8.10.4.1 Clock Specifications
      5. 8.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.10.5.1 Peripheral Description
        2. 8.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. 8.10.5.2.1 SPI Timing Conditions
          2. 8.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
          3. 8.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
        3. 8.10.5.3 SPI Peripheral Mode I/O Timings
          1. 8.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
        4. 8.10.5.4 Typical Interface Protocol Diagram (Peripheral Mode)
      6. 8.10.6  LVDS Interface Configuration
        1. 8.10.6.1 LVDS Interface Timings
      7. 8.10.7  General-Purpose Input/Output
        1. 8.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 8.10.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 8.10.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 8.10.9  Serial Communication Interface (SCI)
        1. 8.10.9.1 SCI Timing Requirements
      10. 8.10.10 Inter-Integrated Circuit Interface (I2C)
        1. 8.10.10.1 I2C Timing Requirements (1)
      11. 8.10.11 Quad Serial Peripheral Interface (QSPI)
        1. 8.10.11.1 QSPI Timing Conditions
        2. 8.10.11.2 Timing Requirements for QSPI Input (Read) Timings (1) (1)
        3. 8.10.11.3 QSPI Switching Characteristics
      12. 8.10.12 ETM Trace Interface
        1. 8.10.12.1 ETMTRACE Timing Conditions
        2. 8.10.12.2 ETM TRACE Switching Characteristics
      13. 8.10.13 Data Modification Module (DMM)
        1. 8.10.13.1 DMM Timing Requirements
      14. 8.10.14 JTAG Interface
        1. 8.10.14.1 JTAG Timing Conditions
        2. 8.10.14.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 8.10.14.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Processor Subsystem
      3. 9.3.3 Host Interface
      4. 9.3.4 Main Subsystem Cortex-R4F
      5. 9.3.5 DSP Subsystem
      6. 9.3.6 Hardware Accelerator
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Channels (Service) for User Application
        1. 9.4.1.1 GP-ADC Parameter
  10. 10Monitoring and Diagnostics
    1. 10.1 Monitoring and Diagnostic Mechanisms
      1. 10.1.1 Error Signaling Module
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Reference Schematic
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALP|180
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.10.4.1 Clock Specifications

The IWR6843AOP requires external clock source (that is, a 40-MHz crystal or external oscillator to CLKP) for initial boot and as a reference for an internal APLL hosted in the device. An external crystal is connected to the device pins. Figure 8-5 shows the crystal implementation.

GUID-62CC1E1F-875F-4333-8EC1-D69BFD9DE1A4-low.gifFigure 8-5 Crystal Implementation
Note:

The load capacitors, Cf1 and Cf2 in Figure 8-5, should be chosen such that Equation 1 is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator CLKP and CLKM pins.

Equation 1. GUID-ABEB21DF-C4ED-46A1-8A95-1E534ADF5429-low.gif

Table 8-5 lists the electrical characteristics of the clock crystal.

Table 8-5 Crystal Electrical Characteristics (Oscillator Mode)
NAMEDESCRIPTIONMINTYPMAXUNIT
fP Parallel resonance crystal frequency 40 MHz
CLCrystal load capacitance5812pF
ESRCrystal ESR50Ω
Frequency tolerance Crystal frequency tolerance(1)(2)(3) –50 50 ppm
Drive level50200µW
(1) The crystal manufacturer's specification must satisfy this requirement.
(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance.
(3) Crystal tolerance affects radar sensor accuracy.

In the case where an external clock is used as the clock resource, the signal is fed to the CLKP pin only; CLKM is grounded. The phase noise requirement is very important when a 40-MHz clock is fed externally. Table 8-6 lists the electrical characteristics of the external clock signal.

Table 8-6 External Clock Mode Specifications
PARAMETER SPECIFICATION UNIT
MIN TYP MAX
Input Clock:
External AC-coupled sine wave or DC-coupled square wave
Phase Noise referred to 40 MHz		 Frequency 40 MHz
AC-Amplitude 700 1200 mV (pp)
DC-Vil 0.00 0.20 V
DC-Vih 1.6 1.95 V
Phase Noise at 1 kHz –132 dBc/Hz
Phase Noise at 10 kHz –143 dBc/Hz
Phase Noise at 100 kHz –152 dBc/Hz
Phase Noise at 1 MHz –153 dBc/Hz
Duty Cycle 35 65 %
Freq Tolerance –100 100 ppm