SWRS237B April   2020  – July 2022 IWR6843AOP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
      1. 7.2.1 Pin Functions - Digital and Analog [ALP Package]
    3. 7.3 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Supply Specifications
    6. 8.6  Power Consumption Summary
    7. 8.7  RF Specification
    8. 8.8  CPU Specifications
    9. 8.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1  Antenna Radiation Patterns
        1. 8.10.1.1 Antenna Radiation Patterns for Receiver
        2. 8.10.1.2 Antenna Radiation Patterns for Transmitter
      2. 8.10.2  Antenna Positions
      3. 8.10.3  Power Supply Sequencing and Reset Timing
      4. 8.10.4  Input Clocks and Oscillators
        1. 8.10.4.1 Clock Specifications
      5. 8.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.10.5.1 Peripheral Description
        2. 8.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. 8.10.5.2.1 SPI Timing Conditions
          2. 8.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
          3. 8.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
        3. 8.10.5.3 SPI Peripheral Mode I/O Timings
          1. 8.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
        4. 8.10.5.4 Typical Interface Protocol Diagram (Peripheral Mode)
      6. 8.10.6  LVDS Interface Configuration
        1. 8.10.6.1 LVDS Interface Timings
      7. 8.10.7  General-Purpose Input/Output
        1. 8.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 8.10.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 8.10.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 8.10.9  Serial Communication Interface (SCI)
        1. 8.10.9.1 SCI Timing Requirements
      10. 8.10.10 Inter-Integrated Circuit Interface (I2C)
        1. 8.10.10.1 I2C Timing Requirements (1)
      11. 8.10.11 Quad Serial Peripheral Interface (QSPI)
        1. 8.10.11.1 QSPI Timing Conditions
        2. 8.10.11.2 Timing Requirements for QSPI Input (Read) Timings (1) (1)
        3. 8.10.11.3 QSPI Switching Characteristics
      12. 8.10.12 ETM Trace Interface
        1. 8.10.12.1 ETMTRACE Timing Conditions
        2. 8.10.12.2 ETM TRACE Switching Characteristics
      13. 8.10.13 Data Modification Module (DMM)
        1. 8.10.13.1 DMM Timing Requirements
      14. 8.10.14 JTAG Interface
        1. 8.10.14.1 JTAG Timing Conditions
        2. 8.10.14.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 8.10.14.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Processor Subsystem
      3. 9.3.3 Host Interface
      4. 9.3.4 Main Subsystem Cortex-R4F
      5. 9.3.5 DSP Subsystem
      6. 9.3.6 Hardware Accelerator
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Channels (Service) for User Application
        1. 9.4.1.1 GP-ADC Parameter
  10. 10Monitoring and Diagnostics
    1. 10.1 Monitoring and Diagnostic Mechanisms
      1. 10.1.1 Error Signaling Module
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Reference Schematic
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALP|180
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002 (2)(3) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process
(3) Corner pins are rated as ±750 V