SWRS323 November   2023  – April 2024 IWRL6432AOP

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2.     10
    3. 6.2 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
      13.      24
      14.      25
      15.      26
      16.      27
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
      1. 7.6.1 Power Optimized 3.3V I/O Topology
      2. 7.6.2 Power Optimized 1.8V I/O Topology
      3. 7.6.3 BOM Optimized 3.3V I/O Topology
      4. 7.6.4 BOM Optimized 1.8V I/O Topology
      5. 7.6.5 System Topologies
        1. 7.6.5.1 Power Topologies
          1. 7.6.5.1.1 BOM Optimized Mode
          2. 7.6.5.1.2 Power Optimized Mode
      6. 7.6.6 Internal LDO output decoupling capacitor and layout conditions for BOM optimized topology
        1. 7.6.6.1 Single-capacitor rail
          1. 7.6.6.1.1 1.2V Digital LDO
        2. 7.6.6.2 Two-capacitor rail
          1. 7.6.6.2.1 1.2V RF LDO
          2. 7.6.6.2.2 1.2V SRAM LDO
          3. 7.6.6.2.3 1.0V RF LDO
      7. 7.6.7 Noise and Ripple Specifications
    7. 7.7  Power Save Modes
      1. 7.7.1 Typical Power Consumption Numbers
    8. 7.8  Peak Current Requirement per Voltage Rail
    9. 7.9  Supported DFE Features
    10. 7.10 RF Specification
    11. 7.11 CPU Specifications
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Antenna Radiation Patterns
      1. 7.13.1 Antenna Radiation Patterns for Receiver
      2. 7.13.2 Antenna Radiation Patterns for Transmitter
    14. 7.14 Antenna Positions
    15. 7.15 Timing and Switching Characteristics
      1. 7.15.1  Power Supply Sequencing and Reset Timing
      2. 7.15.2  Synchronized Frame Triggering
      3. 7.15.3  Input Clocks and Oscillators
        1. 7.15.3.1 Clock Specifications
      4. 7.15.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.15.4.1 McSPI Features
        2. 7.15.4.2 SPI Timing Conditions
        3. 7.15.4.3 SPI—Controller Mode
          1. 7.15.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.15.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.15.4.4 SPI—Peripheral Mode
          1. 7.15.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.15.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.15.5  RDIF Interface Configuration
        1. 7.15.5.1 RDIF Interface Timings
        2. 7.15.5.2 RDIF Data Format
      6. 7.15.6  General-Purpose Input/Output
        1. 7.15.6.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      7. 7.15.7  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.15.7.1 Dynamic Characteristics for the CANx TX and RX Pins
      8. 7.15.8  Serial Communication Interface (SCI)
        1. 7.15.8.1 SCI Timing Requirements
      9. 7.15.9  Inter-Integrated Circuit Interface (I2C)
        1. 7.15.9.1 I2C Timing Requirements
      10. 7.15.10 Quad Serial Peripheral Interface (QSPI)
        1. 7.15.10.1 QSPI Timing Conditions
        2. 7.15.10.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.15.10.3 QSPI Switching Characteristics
      11. 7.15.11 JTAG Interface
        1. 7.15.11.1 JTAG Timing Conditions
        2. 7.15.11.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.15.11.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
      2. 8.3.2 Clock Subsystem
      3. 8.3.3 Transmit Subsystem
      4. 8.3.4 Receive Subsystem
      5. 8.3.5 Processor Subsystem
      6. 8.3.6 Host Interface
      7. 8.3.7 Application Subsystem Cortex-M4F
      8. 8.3.8 Hardware Accelerator (HWA1.2) Features
        1. 8.3.8.1 Hardware Accelerator Feature Differences Between HWA1.1 and HWA1.2
    4. 8.4 Other Subsystems
      1. 8.4.1 GPADC Channels (Service) for User Application
      2. 8.4.2 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. 9 Monitoring and Diagnostics
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • AMY|101
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.10 RF Specification

Over recommended operating conditions (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
Receiver Effective isotropic noise figure (EINF) (1) 57 to 63.9GHz

Tx Back off = 0dB

 16.2 dB

Tx Back off = 6dB

 11.8
1-dB compression point (Out Of Band)(2) –9 dBm
IF bandwidth(3) 5 MHz
ADC sampling rate (real) 12.5 Msps
ADC resolution 12 Bits
Transmitter

Single transmitter output power EIRP

 15 dBm
Power backoff range 26 dB
Clock subsystem Frequency range 57 63.9 GHz
Ramp rate

400

 MHz/µs
Phase noise at 1MHz offset 57 to 63.9GHz –89 dBc/Hz
(1) With single TX ON. EINF varies with RF and TX-RX combination. Please refer to Tx back off and Rx gain recommendation for xWRL6432AOP.
(2) 1-dB Compression Point (Out Of Band) is measured by feed a Continuous wave Tone well below the lowest HPF cut-off frequency.
(3) The analog IF stages include high-pass filtering, with configurable first-order high-pass corner frequency. The set of available HPF corners is summarized as follows:
Available HPF Corner Frequencies (kHz)
175, 350, 700, 1400
The filtering performed by the digital baseband chain is targeted to provide less than ±0.5dB pass-band ripple/droop.